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Corporation
ELECTRONICS | Chips & Semiconductors / Semiconductors
asmpacific.com

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Investments

1

Partners & Customers

2

About ASM Pacific Technology

ASM International is a Dutch company active in the semiconductor industry. The company was founded by Arthur del Prado in 1968.

ASM Pacific Technology Headquarter Location

Almere,

Netherlands

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ASM Pacific Technology Web Traffic

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Page Views per User (PVPU)
Page Views per Million (PVPM)
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ASM Pacific Technology Rank

Latest ASM Pacific Technology News

ASM Pacific Technology Reaches Milestone with 250th Thermo-Compression Bonding Tool Shipped to Customers

Mar 3, 2021

) ASM Pacific Technology (ASMPT), a leading global supplier of hardware and software solutions for the manufacturing of semiconductors and electronics, announced that it has shipped its 250th Thermo-Compression Bonding (TCB) tool to customers in Feb 2021. This milestone highlights ASMPT’s leadership in TCB, a technology it has heavily invested in innovation and co-pioneered with a leading customer, in order to deliver a reliable high volume manufacturing (HVM) tool to the market. Presently, ASMPT is in its 3rd generation of TCB bonders for the TC-CUF (Thermo-Compression-Capillary Underfill) process, which the company has progressively evolved from chip-to-substrate (C2S), chip-to-wafer (C2W) to the current ultra-precision, high throughput tool that is scalable for future needs of the industry and customers. With traditional mass reflow flip chip (MR FC) technology reaching the limits of its capabilities, ASMPT’s TCB technology continues to support its customers’ technology roadmaps in High Performance Computing and adjacent applications. By ASMPT’s internal market assessment, the company believes it has the largest installed base of TCB tools and customers in the world, and is a clear leader in the TC-CUF and TCB bonder market. “Thanks to close collaboration with our lead customers, we have very extensive experience with TCB technology and are deeply privileged to be chosen by our customers as the preferred TCB tool for the TC-CUF process” explained Mr Lim Choon Khoon, CEO of ASMPT’s IC/Discrete & CIS Business Unit, Semiconductor Solutions Segment. “We are committed to push technological boundaries and process capabilities with our next-generation tools that enable exponential scaling in chip interconnect that can directly address our customers’ Advanced Packaging and Heterogeneous Integration requirements.” Since 2013, ASMPT has been able to enable high volume TC-CUF manufacturing. ASMPT is confident that with the advent of its new platform, it will continue to renew its value proposition by continuing to improve capabilities in precision, speed, reliability and scalability, in order to help sustain its leadership in the TC-CUF space. Website Promotion ASM Assembly Systems GmbH & Co. KG As a global technology and market leader, ASMPT (HKEX stock code: 0522), develops and provides leading edge solutions in surface mount technology, equipment and materials for the semiconductor assembly and packaging industries. Its surface mount technology solutions are deployed in a wide range of end-user markets including electronics, mobile communications, automotive, industrial and LED. Our continuous investment in research and development help to provide our customers with innovative and cost-efficient solutions and systems that enable them to achieve higher productivity, greater reliability and enhanced quality. Listed on the Hong Kong Stock Exchange since 1989, ASMPT is currently one of the constituent stocks on the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes and the Hang Seng Hong Kong 35 Index. To learn more about ASMPT, please visit our website at www.asmpacific.com . Das könnte Sie auch interessieren 17.02.2021

ASM Pacific Technology Investments

1 Investments

ASM Pacific Technology has made 1 investments. Their latest investment was in Critical Manufacturing as part of their Corporate Minority on August 8, 2018.

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ASM Pacific Technology Investments Activity

investments chart

Date

Round

Company

Amount

New?

Co-Investors

Sources

8/2/2018

Corporate Minority

Critical Manufacturing

Yes

1

Date

8/2/2018

Round

Corporate Minority

Company

Critical Manufacturing

Amount

New?

Yes

Co-Investors

Sources

1

ASM Pacific Technology Acquisitions

3 Acquisitions

ASM Pacific Technology acquired 3 companies. Their latest acquisition was Automation Engineering on September 30, 2021.

Date

Investment Stage

Companies

Valuation
Valuations are submitted by companies, mined from state filings or news, provided by VentureSource, or based on a comparables valuation model.

Total Funding

Note

Sources

9/30/2021

Acquired

$1.15M

Acquired - II

2

4/6/2018

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$99M

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10

4/4/2018

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$99M

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10

Date

9/30/2021

4/6/2018

4/4/2018

Investment Stage

Acquired

Companies

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Valuation

Total Funding

$1.15M

$99M

$99M

Note

Acquired - II

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Sources

2

10

10

ASM Pacific Technology Partners & Customers

2 Partners and customers

ASM Pacific Technology has 2 strategic partners and customers. ASM Pacific Technology recently partnered with EV Group on February 2, 2021.

Date

Type

Business Partner

Country

News Snippet

Sources

2/2/2021

Partner

EV Group

Austria

EV Group, ASM partner for 3D-IC, chiplet bonding

EV Group and ASM Pacific Technology have agreed to co-develop die-to-wafer hybrid bonding techniques for 3D-IC , heterogeneous integration .

1

7/21/2020

Client

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10

Date

2/2/2021

7/21/2020

Type

Partner

Client

Business Partner

EV Group

Country

Austria

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News Snippet

EV Group, ASM partner for 3D-IC, chiplet bonding

EV Group and ASM Pacific Technology have agreed to co-develop die-to-wafer hybrid bonding techniques for 3D-IC , heterogeneous integration .

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Sources

1

10

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