Binghamton Semiconductor Packaging's Grant

Binghamton Semiconductor Packaging raised a round of funding on January 22, 2007. Investors include National Science Foundation.

Binghamton Semiconductor Packaging is a company that received a STTR Phase I grant for a project entitled: Flexible Flip Chip Connection (F2C2) Technology. Their project will advance a modified electr…

Articles about Binghamton Semiconductor Packaging's Grant: