Ziptronix ziptronix.com


Ziptronix is a developer of semiconductor wafer bonding process that has broad application in semiconductor integration to create such products and 3D integrated circuits.

Ziptronix is a developer of semiconductor wafer bonding process that has broad application in semiconductor integration to create such products and 3D integrated circuits.

Company (Acquired)

Phone: 919-459-2400

Fax:

5400 Glenwood Ave
Suite G-05
Raleigh, 27612
North Carolina, United States

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Total Funding Date of Last Funding
Ziptronix $66.9M Aug 27, 2015

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Patents

Title Application Date Patent Date Status
(Patent / Application)
Conductive barrier direct hybrid bonding Aug 25, 2015 Apr 24, 2018 Patent
Increased contact alignment tolerance for direct bonding Dec 15, 2016 Dec 26, 2017 Patent
3d ic method and device Jul 30, 2015 Jul 25, 2017 Patent
Heterogeneous annealing method and device Oct 09, 2015 Jul 04, 2017 Patent
Three dimensional device integration method and integrated device Jun 22, 2015 Feb 07, 2017 Patent
See all 40 patents