Ziptronix ziptronix.com


Ziptronix is a developer of semiconductor wafer bonding process that has broad application in semiconductor integration to create such products and 3D integrated circuits.

Ziptronix is a developer of semiconductor wafer bonding process that has broad application in semiconductor integration to create such products and 3D integrated circuits.

Company (Acquired)

Phone: 919-459-2400

Fax:

5400 Glenwood Ave
Suite G-05
Raleigh, 27612
North Carolina, United States

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Total Funding Date of Last Funding
Ziptronix $66.9M Aug 27, 2015

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Patents

Title Application Date Patent Date Status
(Patent / Application)
Room temperature metal direct bonding Apr 22, 2013 Sep 30, 2014 Patent
3d ic method and device Mar 04, 2013 Apr 29, 2014 Patent
Wafer bonding hermetic encapsulation Aug 09, 2004 Nov 24, 2009 Patent
Method for low temperature bonding and bonded structure Jul 08, 2016 Application