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Wafer Level Chip Scale Package

wlcsp.com

Stage

IPO | IPO

Date of IPO

2/10/2014

Market Cap

13.21B

About Wafer Level Chip Scale Package

Wafer Level Chip Scale Package is a supplier of wafer-level chip size packaging and test services for the growing digital imaging and small form factor such as RFID markets

Headquarters Location

China

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Wafer Level Chip Scale Package Patents

Wafer Level Chip Scale Package has filed 1 patent.

The 3 most popular patent topics include:

  • Radio frequency antenna types
  • Antennas (radio)
  • Microwave technology
patents chart

Application Date

Grant Date

Title

Related Topics

Status

7/14/2020

8/24/2021

Radio resource management, Antennas (radio), Radio frequency antenna types, Wireless networking, Information theory

Grant

Application Date

7/14/2020

Grant Date

8/24/2021

Title

Related Topics

Radio resource management, Antennas (radio), Radio frequency antenna types, Wireless networking, Information theory

Status

Grant

Latest Wafer Level Chip Scale Package News

Global Advanced Packaging Technologies Market boosting the growth: Market dynamics and trends, efficiencies Forecasts to 2026

Mar 30, 2020

Global Advanced Packaging Technologies Market Segmentation: Global Advanced Packaging Technologies Market By Technology (Active Packaging, Smart and Intelligent Packaging), End- User (Food, Beverages, Alcoholic Beverages, Non-Alcoholic Beverages, Pharmaceuticals, Industrial & Chemicals, Cosmetics & Personal Care, Agriculture, Others), Type (3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Silicon in Package, Fan Out Wafer Lever Package, Wafer Level Chip Scale Package, Flip Chip, Others), Industry Vertical (Consumer Electronics, IT & Telecommunication, Industrial, Automotive & Transport, Healthcare, Aerospace & Defense, Others), Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa) – Industry Trends and Forecast to 2026 Global advanced packaging technologies market is set to witness a substantial CAGR of 7.67% in the forecast period of 2019- 2026. The report contains data of the base year 2018 and historic year 2017. Increasing R&D investment for product development and technological advancement and development are the factor for the growth of this market. Key Market Competitors: Few of the major competitors currently working in the global advanced packaging technologies market are ASE Group., Amkor Technology, Siliconware Precision Industries Co., Ltd., STATS ChipPAC Pte. Ltd., SÜSS MICROTEC SE, IBM Corporation, COVERIS, Universal Instruments Corporation, Heidelberg Instruments, McKinsey & Company., Advanced Packaging Technology (M) Bhd, Veeco Instruments Inc., Boschman, CCL Industries., Jawla Advance Technology, ASM Pacific Technology, Orbotech Ltd., Taiwan Semiconductor Manufacturing Company Limited, ams AG, NAURA Akrion Inc., Rudolph Technologies and others Global Advanced Packaging Technologies Market Report analysis and data lend a hand to businesses for the setting up of strategies related to investment, revenue generation, production, product launches, costing, inventory, purchasing and marketing. Besides this, market drivers, market restraints, opportunities and challenges are evaluated under market overview which gives valuable insights to businesses for taking right moves. Company market share analysis and key company profiles are the major aspects of competitive analysis. Not to mention, the numerical data, statistical data, facts and figures are represented very well in the Global Advanced Packaging Technologies Market report by using charts, graphs and tables so that users can have best understanding. Market Definition: Global Advanced Packaging Technologies Market Advanced packaging is specially designed to improve the device performance by using integrated circuits which protect the metallic part from damaging. 3D integrated circuits, 2.5D integrated circuits, fan out wafer level package and among others are some of the common types of advanced packaging technologies. Different types of integrated circuits are manufactured as per the need of the packaging. They are widely used in industries such as healthcare, automotive, aerospace, defense and others. Table of Contents Market Drivers: Increasing R&D activities will propel the growth of the market Rising demand of these packaging from food and beverage industry will also act as a factor driving the market growth Technological advancement and development in packaging technologies is driving the growth of the market Market Restraints: Dearth of standardization will also hamper the growth of the market Key Developments in the Market: In August 2018, Rudolph Technologies, Inc. announced the launch of their new Dragonfly G2 platform which is specially designed to provide more choices for advanced packaging to the customers so that they will be able to get wafer based applications on the single platform. It also has camera technology so that they can increase the productivity. The main aim of the launch is to meet the requirement for high quality products In July 2017, Kulicke & Soffa Industries, Inc. announced that they have acquired Liteq BV. This acquisition will help the company to strengthen their market position and will also help them to expand their advanced packaging portfolio. The company will use Liteq technologies and services in order to provide advanced packaging services to their customers Competitive Analysis: Global advanced packaging technologies market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of advanced packaging technologies market for Global, Europe, North America, Asia-Pacific, South America and Middle East & Africa. Key Insights in the report: Complete market analysis and forecasting Market definition, understanding the concept of advanced packaging technologies Market drivers and restraints of the industry Market segmentations and market share divided amongst them Key players in the market and their analysis Key Points mentioned in the report: What was the market size in 2016? What are the moves of key players? Which region is leading the market at global level? A comprehensive/competitive analysis of the market? What the drivers and restrains are for the Global Advanced Packaging Technologies Market ?

Wafer Level Chip Scale Package Web Traffic

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Wafer Level Chip Scale Package Frequently Asked Questions (FAQ)

  • What is Wafer Level Chip Scale Package's latest funding round?

    Wafer Level Chip Scale Package's latest funding round is IPO.

  • Who are the investors of Wafer Level Chip Scale Package?

    Investors of Wafer Level Chip Scale Package include Infinity Fund.

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