TeraSi

Aug 21, 2023

Swedish deeptech startup raises €1M to build the next generation of wireless components and packaging Stockholm-based deeptech startup TeraSi has successfully raised €1 million (13MSEK) in pre-seed funding from investors including Navigare Ventures , Almi Invest , Onsight Ventures , and Deeptech Labs , as well as existing backers. TeraSi specializes in developing unique components and packaging solutions for high-frequency wireless applications, focusing on their proprietary system-in-package technology to address packaging challenges and enable the next generation of wireless technologies. The funding will support the development of its system-in-package technology, expand its team, enhance manufacturing capabilities, pursue intellectual property strategies, and launch new products for high-frequency wireless applications. The next generation of wireless will push us to higher frequencies than ever before, bringing massive data rates, unprecedented spatial resolution and a host of new applications to life. For the first time we will exploit frequencies as high as 200 GHz – almost ten times higher than mm-wave systems – at scale. As with all generational shifts, this change is only possible with new technologies that surpass the limitations of today. Decades of academic research has given us chips which can operate at such high frequencies. But we’re still lacking a way to package these chips and build complete systems around them in an efficient, scalable manner. The TeraSi team is delighted to announce they have raised 13 MSEK in a pre-seed round to drive the development of their proprietary system-in-package technology and address this challenge head on. TeraSi’s technology offers best-in-class size, weight and performance for applications above 60 GHz by combining innovative design, precision manufacturing and process automation. The funding comes from leading venture capital firms Navigare Ventures, Almi Invest, Onsight Ventures and Deeptech Labs as well as follow-on investments from all existing investors. “TeraSi has demonstrated an exceptional ability to engineer new RF-solutions that we think will be key to the deployment of next generation wireless technologies like 6G. We look forward to supporting the team as they continue the long tradition of RF-technology development in Sweden,” says Alex Basu , Investment Manager, Navigare Ventures. “TeraSi has a great team and a truly unique technology platform that is on a path to becoming a key enabling technology for the coming 6G communication network. In TeraSi, we see both a very large business potential and the potential to create new and improved services that provide societal impact, so we are very excited about this investment and we look forward to supporting TeraSi on their journey towards realizing that potential,” states Gustav Notander , Investment Manager, Almi Invest. “Since participating in Deeptech Labs’ Spring ‘23 cohort, TeraSi has gone from strength to strength and this marks another key milestone in its journey. We are thrilled to support this latest funding round and look forward to working with the TeraSi team as they continue to scale their technology. Further enhancing their mission in solving high frequency packaging issues and enabling a new frontier of exciting applications,” says Miles Kirby , CEO, Deeptech Labs. TeraSi’s goal is now to implement the first system-in-package modules based on their technology and bring them to market alongside their unique passive components. In the longer term, the company plans to open up their technology to realise its full potential. TeraSi’s first step is to expand their engineering team to meet customer demand. The funding will also allow the team to invest in new manufacturing infrastructure and pursue an aggressive IP strategy. Commercial launch of new products for the test and measurement, radar and wireless markets will follow. “Before we can realise society’s visions of the next generation of wireless we need to build hardware to support it. We believe our technology offers the best combination of performance, compactness and volume scalability and solves the packaging and integration bottleneck above 60 GHz. We’re excited to start scaling our technology and show its true potential over the coming years,” comments James Campion , CEO, TeraSi.