About Silicon Genesis
Silicon Genesis is a developer of intellectual property for the electronics industry. The company's processes focus on production of semiconductor materials using proprietary layer transfer technology and have applications in the semiconductor, solar, and optoelectronic industries.
Expert Collections containing Silicon Genesis
Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.
Silicon Genesis is included in 1 Expert Collection, including Semiconductors, Chips, and Advanced Electronics.
Semiconductors, Chips, and Advanced Electronics
Companies in the semiconductors & HPC space, including integrated device manufacturers (IDMs), fabless firms, semiconductor production equipment manufacturers, electronic design automation (EDA), advanced semiconductor material companies, and more
Silicon Genesis Patents
Silicon Genesis has filed 66 patents.
Semiconductor device fabrication, Microtechnology, Thin film deposition, Mass spectrometry, Integrated circuits
Semiconductor device fabrication, Microtechnology, Thin film deposition, Mass spectrometry, Integrated circuits
Latest Silicon Genesis News
Jan 2, 2019
Silicon Genesis Starts the PolyMax Production System 28 Oct, 2010 September 02, 2010 – San Jose, CA – Silicon Genesis, a leader in process and technology for engineered substrates announced today that it has started production of solar wafers using its new high volume manufacturing PolyMax system. In an industry first, SiGen has produced 85μm thick, 156 mm square kerf-free monocrystalline silicon wafers. Kerf is the material converted into saw dust, inherent in all sawing processes. This achievement delivers the first true mono c-Si kerf-free wafering for the PV industry. The introduction of the PolyMax high volume manufacturing system brings the industry one step closer to replacing wire saw processes with a lower cost waste-free wafering solution. A key strength of the PolyMax system is its ability to produce wafers thinner than is achievable with wire saw technology, allowing the industry to produce cells with higher conversion efficiencies and lower cost. “We believe the benefit of using kerf-free wafers will allow the PV industry to reach unsubsidized grid parity. The start up of our high volume manufacturing system is a key step towards achieving this goal”, said Francois Henley, CEO of SiGen. In an invited talk at the 35th IEEE PV Specialists Conference, Henley reviewed crystalline silicon kerf-free wafering technologies. At the upcoming 25th European Photovoltaic Solar Energy Conference and Exhibition (25th EU PVSEC) in Valencia, Spain, SiGen will present the PolyMax production system (2CV.1.53). About SiGen Silicon Genesis Corporation (SiGen) is a leading provider of engineered substrate process technology for the semiconductor, display, optoelectronics, and solar markets. SiGen’s technology is used for production of Silicon-On-Insulator (SOI) semiconductor wafers for high performance applications. SiGen develops innovative substrates through thin-film engineering, enabling new applications and markets for its customers. SiGen's customers and partners include top players from substrate and device suppliers throughout the world. Founded in 1997, SiGen is headquartered in San Jose, California. For more information on Silicon Genesis, visit http://www.sigen.com Holdings Verdane funds invest in companies with a strong growth potential, mainly within consumer internet, software, energy and advanced industrial sectors. The funds have invested in over 300 companies since 2003.
Silicon Genesis Frequently Asked Questions (FAQ)
When was Silicon Genesis founded?
Silicon Genesis was founded in 1997.
Where is Silicon Genesis's headquarters?
Silicon Genesis's headquarters is located at 2424 Walsh Avenue, San Jose.
What is Silicon Genesis's latest funding round?
Silicon Genesis's latest funding round is Unattributed - II.
How much did Silicon Genesis raise?
Silicon Genesis raised a total of $68.78M.
Who are the investors of Silicon Genesis?
Investors of Silicon Genesis include Firsthand Technology Value Fund, U.S. Department of Energy, Tekla Capital Management, Lake Street Capital, Riverside Management Group and 8 more.
Who are Silicon Genesis's competitors?
Competitors of Silicon Genesis include Wasatch Photonics and 4 more.
Compare Silicon Genesis to Competitors
Hazelcast develops, distributes, and supports open source In-Memory Data Grid. Hazelcast's computing platform is comprised of two core products: Hazelcast IMDG, an in-memory data grid, and Hazelcast Jet, an application embeddable, stream and batch processing engine capable of supporting real-time streaming data.
Nanomaterials and Nanofabrication Laboratories (NN-Labs, LLC) is a Fayetteville, AR based company that has received a grant(s) from the Department of Energy's SBIR/STTR program. The abstract(s) for these grant award(s) are provided as well since they provide insights into Nanomaterials and Nanofabrication Laboratories (NN-Labs, LLC)'s business and areas of expertise. This project will develop novel non-toxic doped-semiconductor nanophosphors to improve the energy efficiency of high brightness white light emitting diodes (LEDs) for general illumination applications. The nationwide energy cost savings for lighting in buildings alone could reach into the billions of dollars annually and provide an environmental benign alternative to fluorescent lamps which contain mercury vapor.
Pinon Technologies is a company that received a STTR Phase I grant for a project entitled: Large scale manufacturing of silicon and germanium nanowires. Their project will develop advanced materials for printed electronics. Nanowires are favorable in printed electronics because their form factor supports high electron mobilities, while at the same time allowing extreme mechanical flexibility. The project will use a process that can deliver the performance required of the market at cost point and throughput needed to meet the need. Additionally, the technology is "green" - focused on making environmentally sound silicon and germanium nanowires. The project will further optimize nanowires for printed electronics and improve the process. The boarder impact/commercial potential of this project will be a break development of advanced materials for the electronics market. The printed electronics market spans across several high value applications - from thin film transistors (TFT) for liquid crystal display (LCD) backplanes to radio frequency identification tags (RFID).
Wasatch Photonics designs, manufactures and markets high-performance Raman spectrometers, Optical Coherence Tomography systems, enhanced holographic optics for optical networking, spectroscopy, test and measurement, and medical imaging applications. Their high-performance Volume Holographic Optical Elements (HOEs) are used in a diverse set of industries, including those in the defense and security, chemical manufacturing, pharmaceutical, medical, energy, education, computer, and electronics markets. Their products are based on patented designs and proprietary holographic recording and manufacturing processes.
Advanced Photonic Crystals is a company that received a STTR Phase I grant for a project entitled: Ammonothermal Growth of Doped Aluminum Gallium Nitride Single Crystals for Energy Efficient Solid State Lighting and Tunable LED's. Their award is funded under the American Recovery and Reinvestment Act of 2009 and their project will address the problem of a multifunctional wide band-gap aluminum gallium nitride single crystal substrate that will enable low-defect, high-performance epitaxial growth. Since much of the energy consumed in the U.S. used for traditional lighting is wasted as heat, solid-state lighting (SSL) has the potential to reduce our energy consumption dramatically. The technology is lacking a critical material that will allow production of high efficiency devices however. Single crystals of AlGaN substrate will enable the production of a tunable bandgap material with a variable band-edge from the visible to the UV range, including the solar blind region between 250-280nm. In addition to solid-state lighting, such a multifunctional material can be used for UV-Vis diode lasers and UV photodetectors in the solar blind region. This technology exploits six years of joint engineering and design of a proven, commercially operational autoclave from APC and Clemson University. The technology can contain the high temperatures and pressures required for hydrothermal growth of oxide crystals (700 C and 4kbar). To accomplish the objectives of Phase I the current hydrothermal model autoclave design will be adapted to work for ammonothermal crystal growth. Broader Impacts project will support the next generation of crystal growth technology in the United States. It will develop a commercially viable route to a key material in solid-state lighting, UV-Vis diode lasers and UV photodetection. The crystal growth industry has exited the United States, leaving a significant gap in the ability to produce strategically important solids onshore. The technical skills to grow single crystals for important materials have decreased significantly in the US. This project will develop a next generation technology that will contribute to US self-sufficiency in a strategic area of materials science. The project will also lead to training of a young postdoctoral fellow in the field of crystal growth, an area that is underdeveloped in the US. The project will also contribute to energy self-sufficiency. Solid-state lighting is expected to save significant energy by improving efficiency and minimizing waste heat. A primary limitation to widespread introduction of solid-state lighting is lack of suitable substrates. This project will provide materials that will enable much high efficiency and long life solid state lighting as well as solid state diode lasers and various other technologies that will provide competitive advantage to the US. Advanced Photonic Crystals is a company that received a SBIR Phase II grant for a project entitled: Hydrothermal Growth of Ultra-High Performance Nd. Their project will focus on the development of a commercial process for the growth of Neodymium Yttrium Vanadate (Nd: YVO4) single crystals for use in solid-state lasers. This research will generate the commercially viable conditions for growth of large boules of single crystals suitable for use in diode pumped solid-state lasers. The hydrothermal method is a low temperature growth technique that leads to crystals containing less thermal strain, much fewer defects and greater homogeneity than conventional methods. These defects combine to cause considerable optical loss and concomitant reduction in performance. The hydrothermal technique has slower growth kinetics and requires chemical development for economically viable growth. In the Phase I project, preliminary growth conditions that lead to suitable single crystals were identified. These conditions include approximate thermal ranges, a variety of starting materials, seed crystals and mineralizer concentrations. In the Phase II project growth conditions will be systematically optimized to provide suitable transport rates and crystal quality. Once an acceptable growth is developed, the resulting boules will be evaluated for performance efficiency and loss. Commercially benefits will emerge as the company introduces new higher performance crystal materials to the market that cannot be grown by existing crystal growth methods. In addition, new laser materials will be donated to Clemson University for design of new laser devices and cavities supporting the University's participation in the emerging photonics Coalition of the Carolinas that includes Clemson, the OptoElectronics Center at UNC-Charlotte, COMSET at Clemson University, and the Carolina MicroOptics Consortium.
Supercon is a company that received a SBIR Phase II grant for a project entitled: A New Production Method for Ta Fibers for Use in Electrolytic Capacitors with Improved Performance and Packaging Options. Their project is intended to develop a new process for manufacturing tantalum (Ta) metal fibers for use in producing tantalum capacitors, and advance this process to the stage of commercialization. This technology, which has been demonstrated in Phase I, could lead to capacitor products having higher performance and greater volumetric efficiency than any currently available. The use of fibers in place of metal powder allows the production of thin anode bodies leading to improved packing options and component performance. The innovation underlying the technology is bundle drawing of Ta filaments in a copper matrix. A composite consisting of Ta filaments in a copper matrix is drawn is a series of reduction steps until the filaments are less than about 10 microns in diameter. The drawn wire is rolled to produce ribbon-type filaments that are 1 micron or less in thickness. The copper composite matrix is chemically dissolved without attacking the Ta to produce metallic Ta high surface area, ribbon-fibers. The fibers are formed into thin mats, which are sintered to produce porous metal strips from which high surface area capacitor anodes are made. A significant aspect of this approach is that fiber morphology can be varied over a wide of fiber thicknesses unlike powder. This allows the morphology of the fibers to be optimized for the particular voltage rating and use requirements in order to maximize the performance of the capacitor. Commercially, nearly all medical, automotive, military and many consumer electronic devices utilize Ta electrolytic capacitors due to their outstanding performance, reliability and volumetric efficiency. Solid electrolytic capacitors are currently made from Ta metal powder. Several million pounds per year of Ta powder are consumed in manufacturing Ta capacitors for these applications. The trend in electronics is toward high powder components and increased miniaturization. Combined with the need to lower materials and manufacturing costs, these considerations have created an opportunity for new method of producing solid electrolytic capacitors. Fiber metal technology has the potential to both lower manufacturing costs, improve capacitor performance, and improve packaging options, which could enable the development of new product that are either currently very difficult or very expensive to make using current technology base on metal powder. Supercon is a company that received a SBIR Phase I grant for a project entitled: A New Production Method for Ta Fibers for Use in Electrolytic Capacitors with Improved Performance and Packaging Options. Their project is intended to demonstrate a new process for manufacturing valve metal fibers for use in producing capacitors. The technology is applicable to all valve metals used for making solid electrolytic capacitors. If successful, this technology could lead to capacitor products having higher performance and greater volumetric efficiency than are currently available. The use of fibers in place of the standard powder compacts allows the production of thin anode bodies leading to improved packaging options and component performance. The innovation underlying the technology is bundle drawing of valve metal filaments contained in copper matrix. A composite consisting of valve metal filaments in a copper matrix is drawn in series of reduction steps until the filaments are less than 10 microns. The drawn wire is rolled to produce submicron thick ribbon type filaments. The copper composite matrix is chemically dissolved to produce metallic thin fibers. The fibers are formed into thin mats, which are sintered to produce porous metal strips from which high surface area capacitor anodes can be made. A significant aspect of this approach is that fiber morphology can be varied within a wide range of thickness and widths unlike powders. This allows the morphology of the fibers to be optimized in order to maximize the properties of the capacitor. Commercially, nearly all medical, automotive and consumer electronic devices all utilize solid electrolytic capacitors due to their performance, volumetric efficiency, and high reliability. Several million pounds per year of powder are consumed in the manufacture of capacitors for these applications. The trend towards higher power components, and miniaturization, combined with the need to lower materials and manufacturing costs have created an opportunity for new methods of producing solid electrolytic capacitors. Fiber metal technology has the potential to both lower manufacturing costs, improve capacitor performance, and improve packaging options which could lead to new products that are either very difficult or very expensive to make using current methods.