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ELECTRONICS | Electronic Manufacturing Services
sigen.com

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Founded Year

1997

Stage

Growth Equity | Alive

Total Raised

$112.78M

Last Raised

$9.58M | 6 yrs ago

About SiGen

Provider of substrate technology and equipment for solar, semiconductor, and optoelectronics sectors. The company develops technology that aims to reduce the thickness of crystalline silicon cells. The company focuses also on processes for Silicon-on-insulator (SOI) wafer fabrication and specialized SOI fabrication tools for the microelectronics and photonics industries.

SiGen Headquarter Location

145 Baytech Drive

San Jose, California, 95134,

United States

(408)228-5858

Latest SiGen News

Silicon Genesis Has Focused Its Technology Development Efforts into the Emerging 3DIC Application Markets

Apr 3, 2017

Silicon Genesis Has Focused Its Technology Development Efforts into the Emerging 3DIC Application Markets April 03, 2017 02:26 PM Eastern Daylight Time SAN JOSE, Calif.--( BUSINESS WIRE )--Silicon Genesis Corporation (SiGen), a leader in process technology and equipment for engineered substrates, announced today that it has begun developing new technology applications for the emerging markets of Three Dimensional Integrated Circuits (3DIC) and other market applications. SiGen is the pioneer of a beam induced thin-film and thick-film room temperature controlled-cleave layer transfer process. The room temperature aspect of cleaving is uniquely suited for the cleaving and stacking of partially-completed or fully-completed device layers that include metallization, dielectrics and transistors. The company has continued to develop its unique technology from its early days with product applications such as thin-film Silicon-on-Insulator (SOI) wafers and thick-film solar wafers. The company has a strong patent portfolio and has applied for new patents that will allow the company to realize value from its proprietary process technology. The company is aware of the importance of patenting its technology and will continue to vigorously enforce and protect its intellectual property rights as needed. Ted Fong, president and CEO of SiGen said: “We believe the use of our room-temperature controlled cleave layer transfer process technology will become an instrumental part of solving many of the challenges for device layer stacking required by 3DIC applications.” About SiGen SiGen is a leading provider of engineered substrate process technology and equipment for the semiconductor, display, and optoelectronics markets. SiGen’s technology is used for production of Silicon-on-Insulator (SOI) semiconductor wafers for high performance applications. SiGen develops innovative substrates through thin-film and thick-film engineering, enabling new applications and markets for its customers. SiGen's customers and partners include top players from substrate and equipment suppliers throughout the world. Founded in 1997, SiGen is headquartered in Santa Clara, California. For more information, visit http://www.sigen.com Contacts

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