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sic-processing.com

Founded Year

2000

Stage

Acq - Fin | Alive

Total Raised

$62.72M

About SiC Processing

SiC Processing is a service provider in the field of mechanical wet-cutting technologies for the wafer industry, including corresponding logistic solutions. The company specializes in preparing cutting fluids that are used to produce wafers for the photovoltaic and semiconductor industries. Cutting fluids are a viscous slurry consisting of solid silicon carbide and fluid glycol.Silicon carbide is used as a sawing agent in the wafer sawing process, where it is applied to the wiresaw in order to give it the necessary specific hardness to saw wafers. The Glycol acts a substrate for the silicon carbide as well as a coolant. Slurry must be replaced after multiple uses and then either properly disposed of or recycled.With the aid of two processes based on hydrocyclone technology, SiC recovers silicon carbide and glycol from the slurry used by wafer producers and conditions these components such that they can be reused in the sawing process. By doing so, SiC aims to provide its customers long-term cost advantages. In addition to the actual recovery and conditioning services, the SiC Group also offers logistics services for wafer manufacturers in the field of cutting fluid management. These include transport, storage and procurement of input materials and slurry.

SiC Processing Headquarter Location

Dienhof 26

Hirschau, 92242,

Germany

+49-(0)-9622-70-39-0

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Expert Collections containing SiC Processing

Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.

SiC Processing is included in 1 Expert Collection, including Advanced Materials.

A

Advanced Materials

1,244 items

Startups developing new or improved materials (chemicals, alloys, etc.) that provide physical or functional advantages to basic materials.

SiC Processing Patents

SiC Processing has filed 1 patent.

patents chart

Application Date

Grant Date

Title

Related Topics

Status

6/16/2006

8/20/2013

Centrifuges, Pressure vessels, Waste treatment technology, Grinding and lapping, Crystals

Grant

Application Date

6/16/2006

Grant Date

8/20/2013

Title

Related Topics

Centrifuges, Pressure vessels, Waste treatment technology, Grinding and lapping, Crystals

Status

Grant

Latest SiC Processing News

G&P GmbH & Co. KG: SiC Processing GmbH - Neue Sachstandsberichte gegen Nachweis der Anleihegläubigerstellung verfügbar

Nov 11, 2019

München, 11. November 2019 - Der Insolvenzverwalter der SiC Processing GmbH hat der G&P GmbH & Co. KG in ihrer Eigenschaft als gemeinsamer Vertreter der Anleihen WKN: A1H3HQ / ISIN: DE000A1H3HQ1 zwei neue Berichte über den Fortgang des Insolvenzverfahrens über das Vermögen der SiC Processing GmbH zur Verfügung gestellt. ? Anleihegläubiger können eine Kopie der Berichte des Verwalters gegen Nachweis der Gläubigerstellung durch Übersendung eines aktuellen Depotauszuges (nicht älter als 10 Werktage) bei der G&P GmbH & Co. KG anfordern. Entsprechende Anfragen und Nachweis sind per Email zu richten an sic@guentherpartner.de oder per Fax an +49 89 15 98 98 22. Es wird darauf hingewiesen, dass es sich bei dem Insolvenzverfahren über das Vermögen der SiC Processing GmbH um ein nicht öffentliches Verfahren handelt. Eine Weitergabe des Berichts oder seines Inhalts ist daher nicht gestattet. Kontakt: Theatinerstraße 36

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