SiC Processing sic-processing.com


Public lists: green / clean tech (4456)

SiC Processing is a service provider in the field of mechanical wet-cutting technologies for the wafer industry, including corresponding logistic solutions. The company specializes in preparing cutting fluids that are used to produce wafers for the photovoltaic and semiconductor industries. Cutting fluids are a viscous slurry consisting of solid silicon carbide and fluid glycol.Silicon carbide is used as a sawing agent in the wafer sawing process, where it is applied to the wiresaw in order to g...Show all

SiC Processing is a service provider in the field of mechanical wet-cutting technologies for the wafer industry, including corresponding logistic solutions. The company specializes in preparing cutting fluids that are used to produce wafers for the p...Show all

Company (Alive / Active)

Phone: +49-(0)-9622-70-39-0

Fax:

Dienhof 26

Hirschau, 92242
Germany

Latest News

See more competitors data Competitors
Total Funding Date of Last Funding
SiC Processing $62.7M Jun 22, 2010

Web Traffic

Rank

Show (-10)

Engagement (PVPU)

Show (+1%)

Domain Authority Score
Show
Page Views Per Million (PVPM)
Show
Reach Per Million
Show

SEO Statistics

Domain Authority Score Show
Page Authority Score Show
No. External Links Show
No. Links Show

Web Traffic Statistics - Growth

Per Week Per Month Per 6 Months Per Year
Rank Login to see details
Page Views Per Million Login to see details
Page Views Per User Login to see details
Reach Per Million Login to see details

Related SiC Processing Jobs

jobs by Indeed job
						search

Investors

Investor Investor Type Location Participating Rounds
See all 7 investors
There is no Board of Directors data available for this company. Please select another tab.
There is no Competitors data available for this company. Please select another tab.

Patents

Title Application Date Patent Date Status
(Patent / Application)
Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components Jun 16, 2006 Aug 20, 2013 Patent