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SiBEAM

sibeam.com

Founded Year

2004

Stage

Acquired | Acquired

Total Raised

$112.5M

Valuation

$0000 

About SiBEAM

Building on four years of academic research, SiBEAM was founded in December 2004 by a core team from the Berkeley Wireless Research Center (BWRC) and several wireless and high-speed communications industry veterans, including Dr. Bob Brodersen, Chinh Doan, Sohrab Emami, Dr. Gary Baldwin, Dr. C. Bernard Shung, Dr. Tim A. Williams and John Marshall. nnWith research efforts starting in August 2001, the BWRC core team of Dr. Brodersen, Dr. Baldwin, Doan, and Emami set out to test the limits of what would be achievable in standard process CMOS. In December 2002, the team achieved several breakthroughs in modeling higher frequencies in CMOS, resulting in the successful delivery of seven test chips between 2002 and 2004. In June 2004, the core team decided to start a company enabling very high-speed wireless applications at higher frequencies. With an initial vision in place, the development team added Dr. C. Bernard Shung with his multi-gigabit communications experience. To lead and launch the company, the team added the leadership of Dr. Tim Williams, bringing his experience starting up and accelerating wireless companies. And to develop its product and business strategy, the team added John Marshall. With the founding team in place, a new vision was developed leading to a technology, frequency and application focus. (nnIn December 2004, SiBEAM was formally founded and secured seed financing of $1.25M from New Enterprise Associates (NEA) and US Venture Partners (USVP). Just four months later, SiBEAM had validated its vision and garnered the interest of electronics, computer, and handset manufacturers as well as data, voice and video service providers in Asia and North America. In May 2005, SiBEAM raised $15M in equity investment from NEA, USVP and Foundation Capital to develop its first wireless platform. nnIn April 2006, industry veteran, John LeMoncheck joined as President and CEO. LeMoncheck's arrival advances SIBEAM's strategy, growth plan and future unveiling of technology set to transform the wireless landscape. In August 2006, SiBEAM raised $21M in equity investment from the original three venture capital firms. Initially based in Fremont, California, SiBEAM now maintains US offices in Sunnyvale and San Diego, California.n

Headquarters Location

555 North Mathilda Avenue

Sunnyvale, California, 94085,

United States

408-245-3120

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Expert Collections containing SiBEAM

Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.

SiBEAM is included in 1 Expert Collection, including Semiconductors, Chips, and Advanced Electronics.

S

Semiconductors, Chips, and Advanced Electronics

6,250 items

Companies in this collection develop everything from microprocessors to flash memory, integrated circuits specifically for quantum computing and artificial intelligence to OLED for displays, massive production fabs to circuit design firms, and everything in between.

SiBEAM Patents

SiBEAM has filed 23 patents.

patents chart

Application Date

Grant Date

Title

Related Topics

Status

6/30/2008

12/27/2016

Wireless networking, Radio resource management, Binary arithmetic, Ethernet, Telecommunications equipment

Grant

Application Date

6/30/2008

Grant Date

12/27/2016

Title

Related Topics

Wireless networking, Radio resource management, Binary arithmetic, Ethernet, Telecommunications equipment

Status

Grant

Latest SiBEAM News

Fujitsu Chooses Lattice’s SiBEAM Snap Wireless Connector Technology to Simplify USB Connections in Next-Generation Tablet PC

Jan 9, 2018

January 09, 2018 08:00 AM Eastern Standard Time PORTLAND, Ore.--( BUSINESS WIRE )-- Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced that its SiBEAM® Snap™ technology will be integrated in Fujitsu’s next-generation Tablet PC, model Q508. The Q508 will be the first tablet supporting USB 3.1 data transfers at 5 Gbps wirelessly and will be displayed during CES 2018. The product will be available in Japan starting in January 2018. “SiBEAM Snap technology optimizes performance for battery-powered applications and provides a seamless, ultra-fast wireless data connection that makes it an ideal solution for Fujitsu’s Tablet PC,” said Susumu Nikawa, CTO at Fujitsu Client Computing Ltd. “By eliminating physical connectors, SiBEAM Snap technology enabled us to produce a much more robust product design.” This latest design win further demonstrates that Lattice’s SiBEAM Snap wireless connector technology offers a unique advantage in data transfer for a variety of high volume mobile applications, such as smartphones, tablets and notebooks. The production-proven solution also has the ability to extend to broader applications across the consumer and industrial markets – encouraging innovation in Edge connectivity devices for smart homes, smart factories, and more. “SiBEAM Snap technology completely replaces common connectors such as USB, while ensuring high-bandwidth wireless data transfer for a truly connector-free device,” said C.H. Chee, senior director of marketing at Lattice Semiconductor. “We are excited to see continued adoption of SiBEAM Snap products across more mobile applications, and anticipate broader adoption where a robust low power, fast wireless data transfer is critical.” To learn more about SiBEAM Snap technology, please visit http://www.latticesemi.com/en/Products/mmWave/SiBEAMSnap.aspx?pr010918 . Lattice at the CES 2018 – Las Vegas, NV Lattice will be exhibiting at CES 2018 in Las Vegas from Tuesday, Jan. 9 to Friday, Jan. 12, where members of the Lattice team will showcase some of its latest small form factor, low-power FPGAs, Wireless and HDMI technologies targeting Edge connectivity and Edge computing solutions. To schedule a press meeting, please contact:  lattice@racepointglobal.com . To schedule a customer meeting, please visit:  http://www.latticesemi.com/en/About/ContactUs.aspx . About Lattice Semiconductor Lattice Semiconductor (NASDAQ: LSCC) is a leader in smart connectivity solutions at the network edge, where the “things” of IoT live. Our low power FPGA, 60 GHz millimeter wave, video ASSP and IP products deliver edge intelligence, edge connectivity, and control solutions to the consumer, communications, industrial, compute, and automotive markets. Our unwavering commitment to our global customers enables them to accelerate their innovation, creating an ever better and more connected world. Lattice Semiconductor Corporation, Lattice Semiconductor (& design), SiBEAM, SiBEAM Snap and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. The use of the word “partner” does not imply a legal partnership between Lattice and any other entity. GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders. Contacts

SiBEAM Frequently Asked Questions (FAQ)

  • When was SiBEAM founded?

    SiBEAM was founded in 2004.

  • Where is SiBEAM's headquarters?

    SiBEAM's headquarters is located at 555 North Mathilda Avenue, Sunnyvale.

  • What is SiBEAM's latest funding round?

    SiBEAM's latest funding round is Acquired.

  • How much did SiBEAM raise?

    SiBEAM raised a total of $112.5M.

  • Who are the investors of SiBEAM?

    Investors of SiBEAM include Silicon Image, New Enterprise Associates, U.S. Venture Partners, Foundation Capital, Cisco and 7 more.

  • Who are SiBEAM's competitors?

    Competitors of SiBEAM include Brite Semiconductor and 3 more.

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