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Presto Engineering company logo
Corporation
ELECTRONICS | Chips & Semiconductors / Semiconductors
presto-eng.com

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Founded Year

2009

Stage

Loan | Alive

Total Raised

$2.25M

Last Raised

$250K | 2 yrs ago

About Presto Engineering

Presto Engineering provides outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Presto Engineering Headquarter Location

109 Bonaventura Drive

San Jose, California, 95134,

United States

408-372-9500

Latest Presto Engineering News

Presto Engineering and Cadence Partner to Expand Semiconductor Package Design Solutions for Automotive and IoT Markets

Jul 7, 2021

Presto is adopting Cadence Allegro® X Package Designer Plus, Clarity™ 3D Solver, Sigrity™ XtractIM™ technology and Celsius™ Thermal Solver to design IC packaging solutions. Presto plans to provide Cadence with input on software features, functions and workflows specific to their end-customer and market needs. “We are pleased to collaborate with Cadence, a leader in electronic design software, system-level analysis, hardware and IP,” declared Cédric Mayor, vice president global strategy and corporate development at Presto. “Our ability to leverage the Cadence packaging design and analysis workflow will help us broaden our design services for IC packaging customers needing tailored capabilities and specific requirements. In our efforts to date, we have already seen a 50 percent faster turnaround time due to a reduction in design iterations enabled by Cadence technologies.” Collaboration expected to reduce design turnaround and speed time to market “Developing today’s complex semiconductor packages, such as heterogeneous SiPs with 3D chip stacks and high-speed data transfer packages, requires a high level of collaboration between IC designers and package engineers,” said KT Moore, vice president, product management in the Custom IC & PCB Group at Cadence. “With no two package designs being alike, collaborating with Presto allows us to capture insights on state-of-the-art package design trends as well as design team collaboration and workflow productivity.” SiP and 3D packages tend to require many rotations to optimize BOM and design tolerances to enable full control of chip performance reproducibility. With the addition of the Cadence portfolio, Presto offers a comprehensive set of design and qualification tools to help customers achieve the most efficient design for manufacturing (DFM) process, strengthening its position in microelectronics. Posted on July 7, 2021 - (16 views)

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Expert Collections containing Presto Engineering

Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.

Presto Engineering is included in 1 Expert Collection, including Internet of Things ( IoT ).

I

Internet of Things ( IoT )

3,149 items

Presto Engineering Patents

Presto Engineering has filed 1 patent.

patents chart

Application Date

Grant Date

Title

Related Topics

Status

12/10/2007

4/23/2013

Electronic test equipment, Semiconductor device fabrication, Hardware testing, Radio electronics, Planar graphs

Grant

Application Date

12/10/2007

Grant Date

4/23/2013

Title

Related Topics

Electronic test equipment, Semiconductor device fabrication, Hardware testing, Radio electronics, Planar graphs

Status

Grant

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