Predict your next investment

Corporation
BUSINESS PRODUCTS & SERVICES | Packaging
plasticpack.com

See what CB Insights has to offer

Stage

Acquired | Acquired

About Plastic Package

Plastic Package produces proprietary and custom trays and containers primarily for the bakery, confectionary, prepackaged meals and school nutrition markets.

Plastic Package Headquarter Location

4600 Beloit Drive

Sacramento, California, 95838,

United States

916-921-3399

Latest Plastic Package News

Microchip First to Achieve JEDEC Qualification for RT FPGA in Plastic Package

Jul 14, 2021

Microchip First to Achieve JEDEC Qualification for RT FPGA in Plastic Package Article By : Microchip Technology Inc. Microchip's radiation-tolerant FPGA offers the low cost of a JEDEC-qualified plastic package plus the proven reliability of RTG4 FPGA technology. Microchip Technology Inc. has launched the first Radiation Tolerant (RT) FPGA that offers the low cost of a JEDEC-qualified plastic package plus the proven reliability of RTG4 FPGA technology. With this release, developers of small-satellite constellations and other systems used in New Space missions do not need to be screened to full Qualified Manufacturers List (QML) procedures. “This is a major milestone for system designers who need large volumes of space-grade components at low unit cost and reduced lead times so they can keep pace with shorter service launch cycles,” said Ken O’Neill, associate director, space and aviation marketing for Microchip’s FPGA business unit. “These RTG4 FPGAs have very high standards for reliability and radiation protection, while keeping the cost down using plastic packages and Sub-QML screening.” Microchip’s RTG4 Sub-QML FPGA has been qualified to JEDEC standards in a flip-chip 1657 ball grid array (BGA) plastic package, with 1.0 mm ball pitch. It is pin compatible with the company’s QML Class V-qualified RTG4 FPGAs in ceramic packages, making it easy for developers to migrate their designs between New Space and more rigorous Class-1 missions. The RTG4 Sub-QML FPGAs in plastic packages are also available as prototypes in small quantities, allowing designers to evaluate the product and prototype their systems before committing to large volumes of flight models.

Predict your next investment

The CB Insights tech market intelligence platform analyzes millions of data points on venture capital, startups, patents , partnerships and news mentions to help you see tomorrow's opportunities, today.

CB Insights uses Cookies

CBI websites generally use certain cookies to enable better interactions with our sites and services. Use of these cookies, which may be stored on your device, permits us to improve and customize your experience. You can read more about your cookie choices at our privacy policy here. By continuing to use this site you are consenting to these choices.