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Founded Year

2013

Stage

IPO | IPO

Total Raised

$200M

Date of IPO

7/7/2022

About Orbbec Technology

Orbbec Technology (688322.SH) focuses on providing 3D visual perception overall technical solution and aims to let all terminals understand the world. The company's main technology includes a 3D perception chip, optical measurement system, AI chip, industry application algorithm, and so on. The company's technology applies in mobile terminals, smart retail, smart services, smart manufacturing, smart security, digital home, and other fields. The company was founded in 2013 and is based in Shenzhen, China.

Headquarters Location

12th Floor, Union Headquarters Building 63 Xuefu Road, Nanshan District

Shenzhen, Guangdong,

China

+86 400-830-8002

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Expert Collections containing Orbbec Technology

Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.

Orbbec Technology is included in 2 Expert Collections, including Robotics.

R

Robotics

1,974 items

This collection includes startups developing autonomous ground robots, unmanned aerial vehicles, robotic arms, and underwater drones, among other robotic systems. This collection also includes companies developing operating systems and vision modules for robots.

C

Conference Exhibitors

5,302 items

Orbbec Technology Patents

Orbbec Technology has filed 27 patents.

The 3 most popular patent topics include:

  • 3D imaging
  • Stereoscopy
  • Optical devices
patents chart

Application Date

Grant Date

Title

Related Topics

Status

8/5/2020

9/26/2023

3D imaging, Live-preview digital cameras, Stereoscopy, Image processing, Diagrams

Grant

Application Date

8/5/2020

Grant Date

9/26/2023

Title

Related Topics

3D imaging, Live-preview digital cameras, Stereoscopy, Image processing, Diagrams

Status

Grant

Latest Orbbec Technology News

Orbbec unveils product line collaboration with Microsoft

Aug 23, 2023

The Robot Report Listen to this article Orbbec , a developer of 3D vision systems, announced a suite of products developed in collaboration with Microsoft based on its indirect time-of-flight (iToF) depth-sensing technology that was brought to market with HoloLens 2. This suite of cameras combines Microsoft’s iToF technology with Orbbec’s high-precision depth camera design and in-house manufacturing capabilities and will broaden the application and accessibility of high-performance 3D vision in logistics, robotics, manufacturing, retail, healthcare, and fitness industries. “Orbbec devices built with Microsoft’s iToF technology use the same depth camera module as Azure Kinect Developer Kit and offer identical operating modes and performance,” Amit Banerjee, Head of Platform and Partnerships at Orbbec, said. “Developers can effortlessly migrate their existing applications to Orbbec’s cameras by using the API bridge provided as part of their SDK.” Developers building enterprise solutions can now develop their applications with any of the devices but use the best-matched device for the deployment scenarios, e.g. applications developed and qualified using the Femto Mega can be deployed in harsh industrial applications using the Femto Mega I. Similarly, applications requiring an attached external computer can use the Femto Bolt. All cameras support a sophisticated precise trigger sync system for integration into a multi-sensor, multi-camera network. The devices have one mega-pixel depth camera with a wide 120° field of view (FOV) and a broad range from 0.25m to 5.5m. It’s combined with a high-performance 4K resolution RGB camera with 90° FOV. A 6DOF IMU module provides orientation. Femto Bolt: Customers interested in a solution like Azure Kinect Developer Kit will find Orbbec’s Femto Bolt an ideal match for their commercial deployments. Beyond depth camera and architectural compatibility, it also has a more compact form factor ideal for commercial installations. The RGB camera has been enhanced with HDR capability. This is currently sampling and will be available for volume orders in October. Femto Mega: Announced in January 2023 and currently in production, Femto Mega is still the industry’s highest-resolution smart camera. This device uses a built-in NVIDIA Jetson Nano to run the advanced depth vision algorithms to convert raw data to precise depth images and thus, eliminates the need for an external PC or compute device. It also adds a Power over Ethernet (PoE) connection for both data and power that is ideally suited for deployment where the camera must be placed away from the compute units or in multi-camera solutions. The developer mode SDK allows the execution of AI models on the device. Femto Mega I: Currently shipping, Femto Mega I is the industry’s highest-performance ruggedized intelligent camera with an IP65 rating for warehouses, manufacturing and other harsh environments. The universal trigger control hub enables easy connection using standard ethernet cables for multi-camera and multi-sensor networks. The SDK enables easy setup and registration, and a rich set of APIs allows integration with various applications. “Since 2021, we’ve collaborated with Orbbec to bring more camera options using Microsoft’s iToF depth technology into the market to cater to a broad range of usage scenarios,” Swati Mehta, Senior Director of Engineering at Microsoft, said. “The availability of Orbbec’s products provides customers with a broad set of choices that make 3D sensing technology accessible globally for a wider range of applications.” “Orbbec’s mission is to provide superior, accessible, and easy-to-integrate RGB-D technology,” David Chen, Co-Founder and Head of Products at Orbbec 3D, said. “Beyond our standard products, we can help customers with custom design and ODM services backed by our specialized design skills and manufacturing experience in high-performance cameras.” Tell Us What You Think!

Orbbec Technology Frequently Asked Questions (FAQ)

  • When was Orbbec Technology founded?

    Orbbec Technology was founded in 2013.

  • Where is Orbbec Technology's headquarters?

    Orbbec Technology's headquarters is located at 12th Floor, Union Headquarters Building, Shenzhen.

  • What is Orbbec Technology's latest funding round?

    Orbbec Technology's latest funding round is IPO.

  • How much did Orbbec Technology raise?

    Orbbec Technology raised a total of $200M.

  • Who are the investors of Orbbec Technology?

    Investors of Orbbec Technology include Midea Group, China Development Bank Capital, Sfund, Huacheng Venture Capital Partnership, National Manufacturing Transformation and Upgrade Fund and 18 more.

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  • Stalk the smart money
  • Identify tomorrow's challengers
  • Spot growing industries
  • Kill analyst data work
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