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Open Silicon

open-silicon.com

Founded Year

2003

Stage

Acquired | Acquired

Total Raised

$44.55M

Valuation

$0000 

About Open Silicon

Open-Silicon is a fabless ASIC company developing a custom ASIC solution for electronics product customers. Per the company, Open Silicon optimizes the chip supply chain through a wide portfolio of fabrication process technologies, pre-qualified IP, package assembly and test solutions and a world-class design, product engineering and operations team.

Headquarters Location

490 North McCarthy Boulevard Suite 220

Milpitas, California, 95035,

United States

408-240-5700

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Expert Collections containing Open Silicon

Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.

Open Silicon is included in 1 Expert Collection, including Semiconductors, Chips, and Advanced Electronics.

S

Semiconductors, Chips, and Advanced Electronics

6,250 items

Companies in this collection develop everything from microprocessors to flash memory, integrated circuits specifically for quantum computing and artificial intelligence to OLED for displays, massive production fabs to circuit design firms, and everything in between.

Open Silicon Patents

Open Silicon has filed 4 patents.

patents chart

Application Date

Grant Date

Title

Related Topics

Status

12/8/2014

5/1/2018

Cryptocurrencies, Clock signal, Bitcoin exchanges, Alternative currencies, Synchronization

Grant

Application Date

12/8/2014

Grant Date

5/1/2018

Title

Related Topics

Cryptocurrencies, Clock signal, Bitcoin exchanges, Alternative currencies, Synchronization

Status

Grant

Latest Open Silicon News

OpenLight Launches Open Silicon Photonics Platform

Jun 8, 2022

OpenLight Launches Open Silicon Photonics Platform Article By : Stefani Munoz OpenLight's latest open silicon photonics platform with integrated lasers seeks to provide chip manufacturers with a means to create high-performance, low-power PICs for markets such as datacom, telecom, and LiDAR. OpenLight, a newly launched, independent company formed by investments from Synopsys and Juniper, announced yesterday the world’s first open silicon photonics platform with integrated lasers. The California–based company seeks to provide chip manufacturers with a means to create photonic integrated circuits (PICs) that offer the highest performance possible. Applications will include datacom, telecom, and LiDAR markets, to name a few, all while operating at low power. With a recent exponential increase in the use of artificial–intelligence and machine–learning technologies,  silicon photonics has seen a recent surge . Chipmakers are now setting their sights on PICs thanks to their innate ability to address the growing bandwidth demands of high–level applications. Yet as those bandwidth demands increase in size and complexity and laser integration becomes more costly, chipmakers are at somewhat of an impasse. Tom Mader (Source: OpenLight) “It’s all about scale,” said OpenLight chief operating officer Thomas Mader. “When you make a very big, complex chip, if you don’t have a laser integrated in, you have to couple it from the outside. Whether that’s a separate package, or whether they try to solder it and align it, optical alignment is hard. If you do it once, it’s hard. And if you try to do it four times on a single product or eight times, it becomes progressively harder, and that means yield, that means cost, that means power lost.” This is where OpenLight believes its use of integrated lasers sets it apart from alternative open silicon photonics solutions already  on the market . “There are other open silicon photonics platforms out there that have process design kits, but by adding the laser, that’s a pretty complex thing,” said Daniel Sparacin, vice president of Business Development and Strategy at OpenLight. “It actually adds a lot of complexity to our process design kit [PDK] because we need to worry about internal reflections, noise — things that other process design kits don’t really deal with because they don’t have to. So we’re working with EDA, we’re setting up a whole ecosystem now to enable this, and we’re showing our value both by seeing it from customers and by also enabling new things.” Daniel Sparacin (Source: OpenLight) The company’s PDK, which has passed qualification and reliability tests on Tower’s PH18DA process, consists of integrated lasers, optical amplifiers, modulators, and photodetectors that chipmakers can utilize while designing their own PICs. “One thing that has been stubbornly missing from silicon photonics is the laser,” said Mader. “[With] our PDK, you can plop down a laser when you’re designing your chip, you can plop an optical amplifier, we have an indium phosphide–based modulator, and we have photodetectors. So we have all the active sort of elements, many of which — like the laser and amplifier — are completely unique.” One of the key components that makes laser integration at scale possible, Mader explains, is indium phosphide. By processing indium phosphide directly onto the silicon photonics wafer, it allows chipmakers to achieve scalability, cost advantages, power benefits, and a level of reliability previously unattainable with traditional silicon photonic technologies. “We have an indium phosphide modulator that easily does 200G per wavelength, and we believe we have a nice edge there on silicon–only modulators,” Mader said. “Also, power; ultimately, our modulator is very low–loss, and our laser is very low–loss — the laser only has a few percent loss getting into the silicon. Because we have such low loss between the elements, [and] such low–loss elements, we start to pull away in power efficiency.” Addressing the laser integration challenge in silicon photonics. (Source: OpenLight) (Click image to enlarge) Regarding reliability, Mader explained that by emitting directly into silicon, they can avoid certain failure modes. “Normally, the discrete lasers — they’re like a hunk of indium phosphide that has a structure on it and the edges are a critical part of that laser,” said Mader. “If that edge gets a little defect, it’s one of the ways they fail. We have no edge. We’re actually bonded to silicon, and we emit into silicon, and then we’re [hermetically sealed] on the top, so there are certain failure modes that simply aren’t there.” In addition to its PDK, OpenLight will also offer select manufacturers the option to utilize a 400G–DR4 and 800G–DR8 PIC designs with 2km reach to speed up their time to market. 400G–FR4 and 2x400G–FR4 PIC designs are also in the process of being designed. “We are offering, in select cases, some designs to get customers to market faster,” Mader said. “We have a 400G and 800G PIC design that we’re using as a shortcut.” The company also expects to tape–out the first open multi–project wafer (MPW) shuttle to further lower manufacturing costs. The MPW shuttle will run on the PH18DA process. As of today,  OpenLight  has approximately 40 employees and has obtained over 200 patents. The company is production–ready, with its first customer tape–outs expected in summer 2022. This article was originally published on  EE Times . Stefani Munoz is associate editor of EE Times. Prior to joining EE Times, Stefani was an editor for TechTarget and covered a host of topics around IT virtualization trends and VMware technologies.

Open Silicon Frequently Asked Questions (FAQ)

  • When was Open Silicon founded?

    Open Silicon was founded in 2003.

  • Where is Open Silicon's headquarters?

    Open Silicon's headquarters is located at 490 North McCarthy Boulevard, Milpitas.

  • What is Open Silicon's latest funding round?

    Open Silicon's latest funding round is Acquired.

  • How much did Open Silicon raise?

    Open Silicon raised a total of $44.55M.

  • Who are the investors of Open Silicon?

    Investors of Open Silicon include UIB Capital, Norwest Venture Partners, Sequoia Capital, InterWest Partners, Bridgescale Partners and 4 more.

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