Nexx Systems nexxsystems.com


NEXX Systems is engaged in flip chip and advanced packaging. The product lines include Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals. In March 2012, Nexx Systems was acquired by Tokyo Electron Limited (TEL). The valuation of Nexx Systems was undisclosed. Other terms of the deal were not released. TEL's acquisition of NEXX will expand TEL's advanced packing process by including electrochemical deposition (ECD) and physical vap...Show all

NEXX Systems is engaged in flip chip and advanced packaging. The product lines include Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals. In March 2012, Nexx Systems was acquired by T...Show all

Company (Acquired)

Phone: 978-932-2000

Fax:

900 Middlesex Turnpike
Building 6
Billerica, 01821
Massachusetts, United States

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Total Funding Date of Last Funding
Nexx Systems $36.1M Mar 16, 2012

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Investors

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Patents

Title Application Date Patent Date Status
(Patent / Application)
Balancing pressure to improve a fluid seal May 28, 2010 May 01, 2012 Patent
Method and apparatus for fluid processing a workpiece May 24, 2010 Oct 18, 2011 Patent
Balancing pressure to improve a fluid seal Nov 02, 2005 Jun 01, 2010 Patent
Method and apparatus for fluid processing a workpiece Oct 22, 2004 May 25, 2010 Patent