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INDUSTRIAL | Manufacturing
nexxsystems.com

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Founded Year

2001

Stage

Acquired | Acquired

Total Raised

$36.09M

About Nexx Systems

NEXX Systems is engaged in flip chip and advanced packaging. The product lines include Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals.In March 2012, Nexx Systems was acquired by Tokyo Electron Limited (TEL). The valuation of Nexx Systems was undisclosed. Other terms of the deal were not released. TEL's acquisition of NEXX will expand TEL's advanced packing process by including electrochemical deposition (ECD) and physical vapor deposition (PVD) systems.

Nexx Systems Headquarter Location

900 Middlesex Turnpike Building 6

Billerica, Massachusetts, 01821,

United States

978-932-2000

Latest Nexx Systems News

Tokyo Electron (TEL) Announces Acquisition of NEXX Systems, Inc

Jul 27, 2018

Tokyo Electron Limited (TEL) (Headquarters: Tokyo; President and CEO: Hiroshi Takenaka) has reached a definitive agreement to acquire NEXX Systems, Inc (NEXX) (Headquarters: Massachusetts, USA; President and CEO: Tom Walsh). In the explosive growth of multifunction mobile devices, such as smartphones and tablets, it has become essential to produce thinner and smaller low power consumption devices with increased functionality. Advanced packaging technology addresses this need and, in particular, wafer level packaging to form Lead-free / Cu- pillar bumping and TSV (Through-Silicon Via) on the silicon wafer has emerged as the fastest growing semiconductor packaging technology for over the next five years to come. The acquisition of NEXX by TEL will expand TELs position in advanced packaging to include electrochemical deposition (ECD) and physical vapor deposition (PVD) systems that have won awards for their outstanding performance, low cost of ownership, development flexibility and their extendibility to future applications. Integrating these applications with TELs broad product line-up and leading global support will enable TEL to grow the company’s business portfolio while continuing to offer the best solutions to customers. Hiroshi Takenaka, President and CEO of TEL, remarked: “Delivering superior performance for leading-edge semiconductor manufacturers requires significant innovation in wafer level packaging. NEXX has demonstrated outstanding advantages in electrochemical deposition, a key differentiating technology in this market. TEL’s strategy to advance wafer level packaging will make use of technical synergies only possible between these two companies and will capitalize on both TELs and NEXX’s already profitable core business strengths. Tom Walsh, President and CEO of NEXX, added “We are delighted to join forces with the worlds quintessential master IC tool supplier. We believe NEXX Systems integration into the TEL family will benefit our stakeholders, our team and, most importantly, our customers and everyone with an interest in advanced electronics. By joining the TEL group of companies, NEXX will be able to take major steps along our technology roadmaps to strengthen our competitive positions. Our combination will leverage complementary customer relationships: NEXX provides TEL with an immediate presence in the high growth, back-end packaging arena, while NEXX gains access to front-end growth markets and an unparalleled repository of cutting-edge intellectual property. About NEXX Headquarters; Billerica, MA, USA Sales; 76.5 million dollars (Year 2011) NEXX Systems brings exceptional technical expertise in Copper pillar and lead-free production solutions to flip chip and advanced packaging. Since 2001, NEXX has expanded its customer base to forty, with one hundred and forty-two systems in place and millions of wafers processed. The two product lines provide the most efficient, yet affordable, systems of their kind: Stratus and Apollo. Additional information can be found at www.nexxsystems.com

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Nexx Systems Patents

Nexx Systems has filed 4 patents.

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Application Date

Grant Date

Title

Related Topics

Status

5/28/2010

5/1/2012

Semiconductor device fabrication, Fluid dynamics, Metalworking, Metal forming, Chemical processes

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5/28/2010

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5/1/2012

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Related Topics

Semiconductor device fabrication, Fluid dynamics, Metalworking, Metal forming, Chemical processes

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Grant

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