Founded Year
2003Stage
Acquired | AcquiredTotal Raised
$50MValuation
$0000About NexPlanar
NexPlanar, formerly NeoPad Technologies, builds chemical mechanical planarization (CMP) pads for the semiconductor device industry, offering a full spectrum of ultra-soft to hard pads with molded grooves that minimize defectivity while improving polish quality and consistency. NexPlanar uses nano-domain technology that improves planarity and across-wafer uniformity and can be utilized to customize the CMP pads for specific applications. NexPlanar's nano-lubricants and molded groove technologies allow for low stress CMP (required for advanced CMP applications), result in an order of magnitude fewer defects, low slurry consumption processing and lower overall cost of ownership.
NexPlanar Headquarter Location
7175 NW Evergreen Parkway Suite 200
Hillsboro, Oregon, 97124,
United States
503-846-1025
Latest NexPlanar News
Sep 29, 2015
29 September 2015 Cabot arranges $142m NexPlanar acquisition Intel, Samsung and Entegris are set to exit semiconductor technology provider NexPlanar following an acquisition by Cabot Microelectronics. Author: Thierry Heles, Reporter US-based semiconductor technology developer NexPlanar is set to be acquired by peer Cabot Microelectronics for approximately $142m, providing exits to chip maker Intel, semiconductor technology supplier Entegris and electronics company Samsung. This rest of this content is only accessible to Global Corporate Venturing Subscribers This content is only accessible to subscribers. If you are a subscriber,please sign in. Otherwise, if you would like to try before you buy and haven't previously taken out a free trial, you can do so below. You can also see details on subscriptions by clicking the Subscription Options button.
NexPlanar Patents
NexPlanar has filed 36 patents.
The 3 most popular patent topics include:
- Semiconductor device fabrication
- Colloidal chemistry
- Electronic design
Application Date | Grant Date | Title | Related Topics | Status |
|---|---|---|---|---|
4/5/2017 | 5/21/2019 | Semiconductor device fabrication, Microtechnology, Colloidal chemistry, Grinding and lapping, Electronics manufacturing | Grant | |
Application Date | 4/5/2017 | ||||
|---|---|---|---|---|---|
Grant Date | 5/21/2019 | ||||
Title | |||||
Related Topics | Semiconductor device fabrication, Microtechnology, Colloidal chemistry, Grinding and lapping, Electronics manufacturing | ||||
Status | Grant |