About nCHIP

Developer of custom, high-performance, high-density silicon circuit boards (SiCB) for multichip modules. Engages in design and manufacture of multichip modules for both complementary metal oxide semiconductor (CMOS) and emitter coupled logic (ECL) devices. The SiCB technology, which was developed at Lawrence Livermore National Laboratory, allows for dense interconnect among devices resulting in a three to four times reduction in wire length, compared with conventional printed circuit boards. Interconnection capacitances are also reduced as much as ten-fold. Unlike so-called "wafer-scale integration," the company's SiCBs do not contain any on-board intelligence. nChip and Cadence Design Systems will jointly develop a suite of tools to assist designers of multi-chip modules. In May 1991 nChip announced an alliance with Sumitomo Corp for co-development of packaging, electroplating, and production processes for multichip modules.