Predict your next investment

Corporation
BUSINESS PRODUCTS & SERVICES | Advertising, Marketing & PR
namics.com

See what CB Insights has to offer

Founded Year

1995

Stage

Merger | Merged

About Namics

Namics is a digital brand communications agency working with companies on tasks ranging from strategy and concept creation to implementation, as well as operations and marketing.On November 16th, 2020, Merkle merged with Namics. The terms of the transaction were not disclosed.

Namics Headquarter Location

Unterstrasse 12

St. Gallen, 9000,

Switzerland

+41 71 228 67 77

Latest Namics News

Insights on the Underfill Materials Global Market to 2027 - Featuring Epoxy Technology, NAMICS and Nordson Among Others

Jan 27, 2021

| Source: Research and Markets Dublin, Jan. 27, 2021 (GLOBE NEWSWIRE) -- The "Underfill Materials - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering. The publisher brings years of research experience to the 6th edition of this report. The 177-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed. Global Underfill Materials Market to Reach $465.6 Million by 2027 Amid the COVID-19 crisis, the global market for Underfill Materials estimated at US$291.6 Million in the year 2020, is projected to reach a revised size of US$465.6 Million by 2027, growing at a CAGR of 6.9% over the analysis period 2020-2027. Capillary Underfill Material (CUF), one of the segments analyzed in the report, is projected to record a 7.5% CAGR and reach US$273.1 Million by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the No Flow Underfill Material (NUF) segment is readjusted to a revised 6.4% CAGR for the next 7-year period. The U.S. Market is Estimated at $86.2 Million, While China is Forecast to Grow at 6.4% CAGR The Underfill Materials market in the U.S. is estimated at US$86.2 Million in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$81.3 Million by the year 2027 trailing a CAGR of 6.4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 6.5% and 5.5% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 5.6% CAGR. Molded Underfill Material (MUF) Segment to Record 5.8% CAGR In the global Molded Underfill Material (MUF) segment, USA, Canada, Japan, China and Europe will drive the 5.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$42 Million in the year 2020 will reach a projected size of US$62.5 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$53.5 Million by the year 2027. Competitors identified in this market include, among others: Epoxy Technology, Inc.

Predict your next investment

The CB Insights tech market intelligence platform analyzes millions of data points on venture capital, startups, patents , partnerships and news mentions to help you see tomorrow's opportunities, today.

Namics Patents

Namics has filed 89 patents.

The 3 most popular patent topics include:

  • Semiconductor device fabrication
  • Electronics manufacturing
  • Adhesives
patents chart

Application Date

Grant Date

Title

Related Topics

Status

2/6/2018

8/31/2021

Semiconductor device fabrication, Sedatives, Fluid dynamics, Barbiturates, Thin film deposition

Grant

00/00/0000

00/00/0000

Subscribe to see more

Subscribe to see more

Subscribe to see more

00/00/0000

00/00/0000

Subscribe to see more

Subscribe to see more

Subscribe to see more

00/00/0000

00/00/0000

Subscribe to see more

Subscribe to see more

Subscribe to see more

00/00/0000

00/00/0000

Subscribe to see more

Subscribe to see more

Subscribe to see more

Application Date

2/6/2018

00/00/0000

00/00/0000

00/00/0000

00/00/0000

Grant Date

8/31/2021

00/00/0000

00/00/0000

00/00/0000

00/00/0000

Title

Subscribe to see more

Subscribe to see more

Subscribe to see more

Subscribe to see more

Related Topics

Semiconductor device fabrication, Sedatives, Fluid dynamics, Barbiturates, Thin film deposition

Subscribe to see more

Subscribe to see more

Subscribe to see more

Subscribe to see more

Status

Grant

Subscribe to see more

Subscribe to see more

Subscribe to see more

Subscribe to see more

CB Insights uses Cookies

CBI websites generally use certain cookies to enable better interactions with our sites and services. Use of these cookies, which may be stored on your device, permits us to improve and customize your experience. You can read more about your cookie choices at our privacy policy here. By continuing to use this site you are consenting to these choices.