Link Fab Technologies

Ada Intelligent Equipment develops semiconductor die-bonding machines, flip-chips, high-density wire bonding machines, wafer-level packaging equipment, and MicroLED mass transfer equipment. The company was founded in 2017 and is based in Foshan, Guangdong.

Capcon is an equipment manufacturer that provides products and solutions to the advanced semiconductor assembly and packaging industry. Its solutions include flip-chip bonders, chip-on-wafer bonders, package-on-package bonders, stack die bonders, panel-level die bonders, multi-chip die bonders and more. The company was founded in 2014 and is based in Hong Kong.

LaserStar Technologies is a company that manufactures laser equipment. It offers laser welding systems, laser marking systems, laser engraving systems, and more. It was founded in 1957 and is based in Orlando, Florida.

OSAI Automation System is a semiconductor machinery manufacturing company. It specializes in automation, electronic machines, semiconductor applications, laser technology, and more. It also provides automatic machines for labs and mass production applications. It was founded in 1991 and is based in Scarmagno, Italy.

E-Fab is a TPC company. It delivers precision thin metal parts with tight tolerances that are durable, reliable, and accurate, including shields, contacts, flexures, microstrips, microwave circuits, and many more. It serves technology firms, defense contractors, and medical equipment manufacturers. It was founded in 1982 and is based in Santa Clara, California.

ASMPT (HKSE: 0522.HK) supplies hardware and software solutions for the manufacture of semiconductors and electronics. It specializes in semiconductor assembly equipment and semiconductor packaging equipment. ASMPT was formerly known as ASM Pacific Technology Ltd. It was founded in 1975 and is based in Singapore.