Predict your next investment

ELECTRONICS | Electronic Manufacturing Services
jempac.com

See what CB Insights has to offer

Founded Year

1995

About JemPac International

Developer of a patented system for molding plastic parts for the microelectronics and semiconductor industries. The company has developed a plastic encapsulation process for micro-electronic parts. The company's process eliminates the need for potting, dipping, or high heat and high pressure molding techniques. The plastic molding system can be added to the in-line manufacturing process to encapsulate products.

JemPac International Headquarter Location

525 Round Rock West Drive Suite 300

Round Rock, Texas, 78681,

United States

(512)583-8300

Predict your next investment

The CB Insights tech market intelligence platform analyzes millions of data points on venture capital, startups, patents , partnerships and news mentions to help you see tomorrow's opportunities, today.

CB Insights uses Cookies

CBI websites generally use certain cookies to enable better interactions with our sites and services. Use of these cookies, which may be stored on your device, permits us to improve and customize your experience. You can read more about your cookie choices at our privacy policy here. By continuing to use this site you are consenting to these choices.