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ELECTRONICS | Electronic Manufacturing Services

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Founded Year


About JemPac International

Developer of a patented system for molding plastic parts for the microelectronics and semiconductor industries. The company has developed a plastic encapsulation process for micro-electronic parts. The company's process eliminates the need for potting, dipping, or high heat and high pressure molding techniques. The plastic molding system can be added to the in-line manufacturing process to encapsulate products.

JemPac International Headquarter Location

525 Round Rock West Drive Suite 300

Round Rock, Texas, 78681,

United States


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