J-Devices j-devices.co.jp


J-Devices provides full turn-key solution to the semiconductor backend business ranging from package design and characterization, wafer sort, assembly, final test, visual inspection and distribution services. Incorporating the Japanese highest quality of standard in manufacturing, J-Devices has been the key manufacturer of packages for automotive applications in Japan. The Companh offers a wide range of standard and customized products and manufacturing services for automotive, consumer, industr...Show all

J-Devices provides full turn-key solution to the semiconductor backend business ranging from package design and characterization, wafer sort, assembly, final test, visual inspection and distribution services. Incorporating the Japanese highest qualit...Show all

Company (Acquired)

Phone: +81-45-594-6400

Fax:

New Stage Yokohama Bldg 17F, 1-1-32 Shinurashima-cho
Kanagawa-ku
Yokohama, 221-0031
Japan

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Total Funding Date of Last Funding
J-Devices $0M Jan 7, 2016

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Patents

Title Application Date Patent Date Status
(Patent / Application)
Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structure Jan 30, 2017 Mar 20, 2018 Patent
Semiconductor device Jan 13, 2016 Feb 27, 2018 Patent
Semiconductor package and manufacturing method thereof Apr 04, 2016 Dec 05, 2017 Patent
Method for manufacturing a semiconductor package Aug 12, 2016 Oct 10, 2017 Patent
Semiconductor package and its manufacturing method Nov 30, 2016 Aug 01, 2017 Patent
See all 41 patents