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The global market for Audio Driver IC estimated at US$4.5 Billion in the year 2022, is projected to reach a revised size of US$14.7 Billion by 2030, growing at a CAGR of 16% over the analysis period 2022-2030. Consumer Electronics, one of the segments analyzed in the report, is projected to record 16.8% CAGR and reach US$7.3 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Telecommunications segment is readjusted to a revised 15.2% CAGR for the next 8-year period. The U.S. Market is Estimated at $1.2 Billion, While China is Forecast to Grow at 20.6% CAGR
The Audio Driver IC market in the U.S. is estimated at US$1.2 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$3.8 Billion by the year 2030 trailing a CAGR of 20.6% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 11.1% and 13.6% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 12.4% CAGR. Select Competitors (Total 51 Featured) -
Analog Devices, Inc.

Global Audio Driver IC Strategic Business Report 2023: Players Include Icepower, Infineon Technologies, Intersil and Microsemi

Renesas Announces Acquisition of and Tender Offer for Own Shares

Intel Recruits Micron Executive as Next Finance Chief
David Zinsner will join the chip maker, as Intel said the head of its client computing group is leaving at the end of the month
David Zinsner is a former CFO of Analog Devices Inc. and Intersil Corp.
Photo: Micron Technology
Jan. 10, 2022 5:27 pm ET
Intel Corp. INTC 3.31% said it has poached      David Zinsner      from Micron Technology Inc. to be its next chief financial officer as it also announced the departure of one of its highest-profile executives. The semiconductor giant said that      Gregory Bryant,      the head of its client computing group, is leaving at the end of the month. The unit is responsible for Intel’s PC-related business and generates more than half of the company’s sales. Mr. Bryant has had a high-profile run at Intel, a company he joined in 1992. He presented Intel products at this month’s CES technology show in Las Vegas. He is leaving for a new opportunity, Intel said. The chip company tapped      Michelle Johnston Holthaus,      its executive vice president and general manager of the sales, marketing and communications group, as his successor. The group she will now oversee generated $30.38 billion in revenue in the nine months ended Sept. 25, 2021 and netted $40.06 billion in 2020. The personnel changes come about a year after Intel said      Pat Gelsinger      would take over as chief executive after a series of missteps by the company. Mr. Gelsinger has since tried to fast-track Intel’s turnaround, including with a commitment to invest heavily in chip manufacturing and a pledge to return the company to a position of producing the world’s best chips . Ms. Johnston Holthaus will transition to her new role in the coming months and Intel will search for a new person to head its sales, marketing and communications team. Mr. Zinsner, Micron’s finance chief, will join Intel next Monday. He had been with memory-chip maker Micron since February 2018. Before that, he was the president and chief operating officer of 5G specialist Affirmed Networks, which Microsoft Corp. acquired in 2020. He also served as the senior vice president of finance and CFO at both Analog Devices Inc. and Intersil Corp.
Micron said Monday that it has launched a search for its next finance chief and Chief Business Officer      Sumit Sadana      has assumed the additional role of interim CFO. Intel previously said CFO      George Davis      planned to retire in May but will remain with the company in an advisory capacity. Write to Kimberly Chin at kimberly.chin@wsj.com
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Appeared in the January 11, 2022, print edition as 'Intel Names a New CFO.' Sponsored Offers

Intel Recruits Micron Executive as Next Finance Chief

https://www.everythingrf.com/News/details/13440-qorvo-appoints-philip-chesley-as-president-of-infrastructure-defense-products
November 8, 2021  |  Editorial Team
Qorvo , a leading provider of innovative RF solutions that connect the world, announced the appointment of Philip Chesley as president of Qorvo’s Infrastructure & Defense Products segment, effective November 1, 2021. Mr. Chesley will report to Bob Bruggeworth, president and CEO of Qorvo, and he will succeed James Klein, who previously announced his intention to retire from the company. Bob Bruggeworth said that they are extremely pleased that Philip Chesley is joining Qorvo to head their diverse and growing Infrastructure & Defense Products (IDP) business. Philip has a proven track record growing world-class organizations at leading technology companies. He also mentioned that Mr. Chesley is deep expertise in RF, power, data communications, automotive, industrial and aerospace/defense markets will serve Qorvo well as he leads their talented IDP team to drive growth. Mr. Chesley most recently served as vice president and general manager of the Industrial and Communications Business Unit at Renesas . He was previously senior VP and general manager of the Automotive, Aerospace, and Analog Product Group at Intersil, which was acquired by Renesas in 2017. He joined Intersil in 2004 and served in several executive leadership roles. Prior to that, he was a founder and a director at Primarion, a pioneer in software-programmable digital multiphase power architectures, which was purchased by Infineon . Mr. Chesley earned an MBA from Duke University’s Fuqua School of Management and a Bachelor of Science degree from Brigham Young University. Bob Bruggeworth further added that they are grateful to James Klein for his years of commercial and technology leadership of IDP. James and his teams have established Qorvo as a leader in high-value markets while more than doubling the size of the business and diversifying Qorvo’s business mix. They thank James for his many contributions to Qorvo’s success and wish him the very best as he retires. Publisher: everything RFhttps://www.everythingrf.comhttps://cdn.everythingrf.com/logo.png23648

Qorvo Appoints Philip Chesley as President of Infrastructure & Defense Products

Qorvo Inc of Greensboro,  NC, USA (which provides core technologies and RF solutions for mobile,  infrastructure and defense applications) has appointed Philip Chesley as president of its Infrastructure & Defense Products (IDP) segment, reporting to president & CEO Bob  Bruggeworth. He succeeds James Klein, who previously announced his intention to  retire from the company. “Philip has a proven track record growing  world-class organizations at leading technology companies,” comments  Bruggeworth. “His deep expertise in RF, power, data communications, automotive,  industrial and aerospace/defense markets will serve Qorvo well as he leads our  talented IDP team to drive growth.”
Chesley most recently served as VP & general manager of the Industrial and Communications business unit at  Renesas. He was previously senior VP & general manager of the  Automotive, Aerospace and Analog Product Group at Intersil, which was  acquired by Renesas in 2017. He joined Intersil in 2004 and served in several  executive leadership roles. Prior to that, he was a founder and a director at  Primarion, a pioneer in software-programmable digital multiphase power  architectures, which was purchased by Infineon. Chesley earned an MBA from Duke  University’s Fuqua School of Management and a Bachelor of Science degree from  Brigham Young University. “We are grateful to James Klein for his  years of commercial and technology leadership of IDP,” comments Bruggeworth. “James and his teams have established Qorvo as a leader in high-value markets  while more than doubling the size of the business and diversifying Qorvo’s business  mix.”
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Qorvo appoints Philip Chesley as president of IDP to succeed James Klein

MicroVision is a company that designs lidar sensors used in automotive safety and autonomous driving applications. It develops MEMS-based laser beam scanning technology that integrates optics, hardware, algorithms, and machine learning software into proprietary systems. The company also provides micro-display concepts and designs utilized in head-mounted augmented reality (AR) headsets. MicroVision was founded in 1993 and is based n Redmond, Washington.

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Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, other handheld systems, and notebooks. Intersil's product families address power management functions and analog signal processing functions. Intersil products include ICs for battery management, hot-swap and hot-plug controllers, linear regulators, power sequencers, supervisory ICs, bridge drivers, PWM controllers, switching DC/DC regulators and power MOSFET drivers; optical storage laser diode drivers; DSL line drivers; video and high-performance operational amplifiers; data converters; interface ICs; analog switches and multiplexers; crosspoint switches; voice-over-IP devices; and ICs for military, space and radiation-hardened applications.

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