Interposers deals with development of a printed wiring interposer as an intermediate layer for the 3D integration of micro electronic components. The main focus is on obtaining IP and their economic extraction and utilization.
Company (Alive / Active)
Phone: +49 (0)89 18920011
|Investor||Investor Type||Location||Participating Rounds|
|Title||Application Date||Patent Date||Status
(Patent / Application)
|Method and a system for producing a semi-conductor module||Sep 24, 2015||May 22, 2018||Patent|
|Method and a system for producing a semi-conductor module||Feb 22, 2011||Oct 20, 2015||Patent|