Interposers interposers.com


Interposers deals with development of a printed wiring interposer as an intermediate layer for the 3D integration of micro electronic components. The main focus is on obtaining IP and their economic extraction and utilization.

Interposers deals with development of a printed wiring interposer as an intermediate layer for the 3D integration of micro electronic components. The main focus is on obtaining IP and their economic extraction and utilization.

Company (Alive / Active)

Phone: +49 (0)89 18920011

Fax:

Dietlindenstr. 15

Munich, 80802
Germany

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Total Funding Date of Last Funding
Interposers $0M Aug 1, 2012

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Investors

Investor Investor Type Location Participating Rounds
High-Tech GrunderfondsVenture CapitalBonn, GermanyUnattributed VC
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Patents

Title Application Date Patent Date Status
(Patent / Application)
Method and a system for producing a semi-conductor module Sep 24, 2015 May 22, 2018 Patent
Method and a system for producing a semi-conductor module Feb 22, 2011 Oct 20, 2015 Patent