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SOFTWARE (NON-INTERNET/MOBILE) | Scientific, Engineering Software
interface-iberica.com

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Stage

Acquired | Acquired

About INTERFACE

INTERFACE is a company, possessing key competencies in product & systems engineering, support engineering and process engineering catering to the aeronautical, power generation, oil & gas, naval and industrial markets.In September 2011, INTERFACE was acquired by QuEST Global Engineering. The valuation of INTERFACE was undisclosed. Other terms of the deal were not released.

INTERFACE Headquarter Location

3773 Corporate Center Drive

Earth City, Missouri, 63045,

United States

Latest INTERFACE News

HiringSolved Promotes Efficient Recruiting Outcomes for Today’s Enterprise With Latest Product Release

Oct 20, 2021

Enhanced Talent Intelligence Insights, New Pattern Predictions, Search-Forward User Interface and More HiringSolved , the leader in AI-powered recruiting and talent acquisition solutions, announced the launch of its newest release for enterprise organizations. Driven by today’s rapidly evolving labor market, HiringSolved puts additional emphasis on the solution’s search and match features as well as data analytics and reporting to help employers source and hire the right talent faster. The challenge of finding qualified, experienced candidates is well-documented, even before the obstacles presented by the Covid-19 pandemic and ensuing Great Resignation. Deloitte detailed these significant changes in its 2021 Global Human Capital Trends: Special Report, noting a substantial disruption in the worker-employer relationship and its subsequent impact on hiring efforts. To best support recruiting teams, HiringSolved sought to prioritize expedience and quality in this new release. With HiringSolved’s newest iteration comes the introduction of several new features, including: Search-forward interface and experience – Updates to HiringSolved’s existing search functionality, complemented by a streamlined user interface, get recruiters the results they are looking for first. Increased access to RAI – HiringSolved’s AI-powered assistant for recruiters, RAI, is now backed into every step of the process, offering intelligent value adds and improving outcomes. Enhanced Talent Intelligence – The improved Diversity Prediction builds on the previous version, providing advanced insights, analytics and visualizations to contextualize diversity across the board. New Pattern Predictions – By analyzing previous patterns, such as job-hopping, HiringSolved can spotlight potential events and flag when it might be time to consider finding a new role or thinking about a replacement. HiringSolved’s 2019 release provided real-time applicant scoring, automated and integrated messaging and RAI-driven talent pool insights and worked to increase recruiting efficiency by 10X while unifying search, reducing busywork and adding transparency to the process. This latest release further augments the solution’s capabilities to help overwhelmed recruiting teams navigating a complex and highly competitive hiring landscape. “Today’s enterprise organizations need intelligent solutions that deliver actionable insights to accelerate hiring. HiringSolved works to empower recruiters, helping them take control of the search and find the candidates they need,” said Jill Stutzman-Deaner, Vice President of Customer Success for HiringSolved. “Having already proven our commitment to time savings in previous releases, we developed our new release to expand our users’ efficiency and demonstrate the value that data adds when applied throughout the process.”

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INTERFACE Patents

INTERFACE has filed 242 patents.

The 3 most popular patent topics include:

  • Capacitors
  • Printed circuit board manufacturing
  • Sensors
patents chart

Application Date

Grant Date

Title

Related Topics

Status

3/12/2019

11/23/2021

Bones of the head and neck, Electronics manufacturing, Semiconductor technology, Packaging (microfabrication), Wafer bonding

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11/23/2021

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Related Topics

Bones of the head and neck, Electronics manufacturing, Semiconductor technology, Packaging (microfabrication), Wafer bonding

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Status

Grant

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