Integrated Materials
Founded Year
1998Stage
Acquired | AcquiredTotal Raised
$17.3MAbout Integrated Materials
Headquartered in Sunnyvale, California, Integrated Materials is a semiconductor manufacturer of pure All-Silicon products for several semiconductor equipment consumables applications. IMI's SiFusion product line aims to offer their customers improvements in yield, total cost of ownership, reduced chemical waste and more environmentally friendly chemical usage.
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Expert Collections containing Integrated Materials
Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.
Integrated Materials is included in 1 Expert Collection, including Semiconductors, Chips, and Advanced Electronics.
Semiconductors, Chips, and Advanced Electronics
6,248 items
Companies in this collection develop everything from microprocessors to flash memory, integrated circuits specifically for quantum computing and artificial intelligence to OLED for displays, massive production fabs to circuit design firms, and everything in between.
Integrated Materials Patents
Integrated Materials has filed 7 patents.

Application Date | Grant Date | Title | Related Topics | Status |
---|---|---|---|---|
9/18/2006 | 12/21/2010 | Semiconductor device fabrication, Thin film deposition, Glass compositions, Chemical processes, Semiconductor devices | Grant |
Application Date | 9/18/2006 |
---|---|
Grant Date | 12/21/2010 |
Title | |
Related Topics | Semiconductor device fabrication, Thin film deposition, Glass compositions, Chemical processes, Semiconductor devices |
Status | Grant |
Latest Integrated Materials News
Jun 23, 2021
Applied Materials' Integrated Materials Solution combines seven different process technologies in one system under high vacuum. Applied Materials Inc. has unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond. While size reduction benefits transistor performance, the opposite is true in the interconnect wiring: smaller wires have greater electrical resistance which reduces performance and increases power consumption. Without a materials engineering breakthrough, interconnect via resistance would increase by a factor of 10 from the 7nm node to the 3nm node, negating the benefits of transistor scaling. Applied Materials has developed a new materials engineering solution called the Endura Copper Barrier Seed IMS, an Integrated Materials Solution that combines seven different process technologies in one system under high vacuum: ALD, PVD, CVD, copper reflow, surface treatment, interface engineering and metrology. The combination replaces conformal ALD with selective ALD, eliminating a high-resistivity barrier at the via interface. The solution also includes copper reflow technology that enables void free gap fill in narrow features. Electrical resistance at the via contact interface is reduced by up to 50 percent, improving chip performance and power consumption, and enabling logic scaling to continue to 3nm and beyond. An animation of the process sequence can be viewed at this link: https://bit.ly/3g8HMe1 . “A smartphone chip has tens of billions of copper interconnects, and wiring already consumes a third of the chip’s power,” said Prabu Raja, Senior Vice President and General Manager of the Semiconductor Products Group at Applied Materials. “Integrating multiple process technologies in vacuum allows us to reengineer materials and structures so that consumers can have more capable devices and longer battery life. This unique, integrated solution is designed to accelerate the performance, power and area-cost roadmaps of our customers.” The Endura Copper Barrier Seed IMS system is now being used by leading foundry-logic customers worldwide. Additional information about the system and other innovations for logic scaling will be discussed at Applied’s 2021 Logic Master Class being held today.
Integrated Materials Frequently Asked Questions (FAQ)
When was Integrated Materials founded?
Integrated Materials was founded in 1998.
Where is Integrated Materials's headquarters?
Integrated Materials's headquarters is located at 1169 Borregas Avenue, Sunnyvale.
What is Integrated Materials's latest funding round?
Integrated Materials's latest funding round is Acquired.
How much did Integrated Materials raise?
Integrated Materials raised a total of $17.3M.
Who are the investors of Integrated Materials?
Investors of Integrated Materials include Ferrotec, Alloy Ventures, Labrador Ventures, Rocket Ventures and American River Ventures.
Who are Integrated Materials's competitors?
Competitors of Integrated Materials include Artificial Muscle and 1 more.
Compare Integrated Materials to Competitors

EoPlex Technologies, Inc. produces components using innovative deposition techniques based on custom printing equipment and proprietary "inks" that carry ceramic, metallic or polymer materials to millions of locations. This allows the manufacture of components with integrated chambers, channels, sensors, circuits, reactors, energy scavengers and other features. Many parts are created simultaneously in large panels and the only tooling required is low-cost printing masks. As a result, there is great flexibility to change designs quickly, allowing fast time to market and even modifications during full production runs. The company is currently using this technology to develop products in markets that include: energy harvesters to replace batteries, micropumps, fuel cell parts, RF devices, thermal devices and fluidic components. EoPlex is a privately held company based in Redwood City, CA and is backed by ATA Ventures, Draper Fisher Jurvetson, Labrador Ventures, and Draper-Richards. For more information, visit http://www.eoplex.com.
Artificial Muscle designs and manufactures an electroactive polymer that converts electrical energy to mechanical motion that can be used in many consumer, medical, industrial, automotive, aerospace, and cleantech applications. Per Artificial Muscle, their technology can offer significant advantages over existing alternatives because of its comparatively smaller size, quieter operation and design flexibility.
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