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About Gradient Design Automation

Gradient Design Automation provides thermal analysis solutions for the power-intensive and temperature-sensitive integrated circuits (ICs) that are used in the automotive, computer, hand-held, and networking application segments. The Gradient products integrate easily into existing IC design flows and provide a rich set of visual analysis capabilities. For the first time, designers can have visibility into the fine-grain temperature profile throughout the design process, locate temperature hotspots, and simulate their impact on the design parameters. Gradient is located in Santa Clara, California.

Gradient Design Automation Headquarter Location

Palo Alto, California, 94301,

United States

650-618-6705

Latest Gradient Design Automation News

TRADE NEWS: Agilent Technologies Acquires Electrothermal Analysis Technology from Gradient Design Automation

Apr 30, 2014

TRADE NEWS: Agilent Technologies Acquires Electrothermal Analysis Technology from Gradient Design Automation Software Identifies Thermal Problems During IC Development April 30, 2014 11:00 AM Eastern Daylight Time SANTA CLARA, Calif.--( BUSINESS WIRE )--Agilent Technologies Inc. (NYSE:A) today announced its acquisition of electrothermal analysis technology from Gradient Design Automation, the maker of HeatWave electrothermal analysis software. Agilent EEsof EDA now has sole ownership of Gradient’s core technology and will serve customers of both the integrated Advanced Design System software solution and Gradient’s HeatWave solution. The electrothermal analysis technology allows designers to identify and correct thermal problems during integrated circuit development. “Thermal management is one of the toughest challenges facing modern IC designers,” said Todd Cutler, general manager of Agilent EEsof EDA. “That’s why our integrated ADS electrothermal solution was so well received by customers following its introduction and has already been adopted by several major RFIC/MMIC vendors. Today’s announcement further reinforces our commitment to continue working to solve this difficult challenge for our customers.” The acquisition stems from a cooperative agreement between Agilent and Gradient that began in 2012, when a version of Gradient’s technology was integrated into the ADS software as part of a comprehensive multitechnology solution for RFIC and MMIC development. In 2013, Agilent announced an expanded business relationship with Gradient that included increased financial commitment on Agilent’s part in exchange for increased access to Gradient’s electrothermal analysis technology. “The growth of Gradient’s business is proof that the unique software technology we created is highly effective at solving an important industry problem,” said Ed Cheng, president of Gradient. “We are quite pleased and excited that Agilent, established market leader in the EDA industry, will now carry the technology forward and work to further expand its market reach.” More information on Agilent’s ADS and its integrated electrothermal solver solution is available at www.agilent.com/find/eesof-ads . A video demonstration of the ADS Electrothermal Simulator is available at http://youtu.be/ifxlz05fZek . Agilent’s newly acquired electrothermal analysis technology will be demonstrated, along with 20 of the company’s newest design and measurement solutions, at IEEE MTT-S International Microwave Symposium 2014 (Booth 1133), June 1-6, in Tampa, Fla. Agilent Partners, co-located around the Agilent booth, will demonstrate solutions for modeling and device characterization; semiconductor foundries; IC, wafer, and PCB design, test, and prototyping; antenna measurement systems and test chambers; and custom systems. In addition, Agilent’s Dr. Robert Shimon, an R&D manager in Agilent’s High Frequency Technology Center, will also provide his insights on “How Digital Markets are Driving Microwave Technology” at the MicroApps Theater on Tuesday, June 3, 10:05–10:45 a.m. About Advanced Design System The leading electronic design automation software for RF, microwave and signal integrity applications, ADS pioneers the most innovative and commercially successful technologies, such as X-parameters* and 3-D electromagnetic simulators. ADS 2014 addresses the most challenging design complexity and integration needs of leading-edge commercial wireless and aerospace/defense companies, by enabling them to design multi-technology RF system-in-package modules and perform complex electromagnetic simulations -all with greater ease and speed. More information is available at www.agilent.com/find/eesof-ads . About Agilent EEsof EDA Software Agilent EEsof EDA is the leading supplier of electronic design automation software for microwave, RF, high-frequency, high-speed digital, RF system, electronic system level, circuit, 3-D electromagnetic, physical design and device-modeling applications. More information is available at www.agilent.com/find/eesof . About Agilent Technologies Agilent Technologies Inc. (NYSE:A) is the world’s premier measurement company and a technology leader in chemical analysis, life sciences, diagnostics, electronics and communications. The company’s 20,600 employees serve customers in more than 100 countries. Agilent had revenues of $6.8 billion in fiscal 2013. Information about Agilent is available at www.agilent.com . On Sept. 19, 2013, Agilent announced plans to separate into two publicly traded companies through a tax-free spinoff of its electronic measurement business. The new company is named Keysight Technologies, Inc. The separation is expected to be completed in early November 2014. *X-parameters is a trademark and registered trademark of Agilent Technologies in the US, EU, JP, and elsewhere. The X-parameters format and underlying equations are open and documented. For more information, visit www.agilent.com/find/eesof-x-parameters-info . NOTE TO EDITORS: Further technology, corporate citizenship and executive news is available at www.agilent.com/go/news . Contacts

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Gradient Design Automation Patents

Gradient Design Automation has filed 6 patents.

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6/2/2008

10/9/2012

Partial differential equations, Computational fluid dynamics, Fluid dynamics, Boundary conditions, Numerical differential equations

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Partial differential equations, Computational fluid dynamics, Fluid dynamics, Boundary conditions, Numerical differential equations

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