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Forum Engineering

forumeng.co.jp

Founded Year

1981

Stage

IPO | IPO

Date of IPO

3/9/2020

Market Cap

21.91B

About Forum Engineering

Forum Engineering (TYO: 7088) is a staffing service company for engineers in Japan, equipped with proprietary AI matching technology to facilitate engineers' lifetime career mobility.

Headquarters Location

2-10-4 Toranomon Minato-ku Okura Prestige Tower 15F

Tokyo, 105-0001,

Japan

+81 03-3560-5505

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Forum Engineering Patents

Forum Engineering has filed 1 patent.

The 3 most popular patent topics include:

  • Biometrics
  • Recruitment
  • Action role-playing video games
patents chart

Application Date

Grant Date

Title

Related Topics

Status

8/29/2018

5/4/2021

Data management, Designer drugs, Biometrics, Surveillance, Geolocation

Grant

Application Date

8/29/2018

Grant Date

5/4/2021

Title

Related Topics

Data management, Designer drugs, Biometrics, Surveillance, Geolocation

Status

Grant

Forum Engineering Web Traffic

Rank
Page Views per User (PVPU)
Page Views per Million (PVPM)
Reach per Million (RPM)
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Forum Engineering Rank

Forum Engineering Frequently Asked Questions (FAQ)

  • When was Forum Engineering founded?

    Forum Engineering was founded in 1981.

  • Where is Forum Engineering's headquarters?

    Forum Engineering's headquarters is located at 2-10-4 Toranomon Minato-ku, Tokyo.

  • What is Forum Engineering's latest funding round?

    Forum Engineering's latest funding round is IPO.

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