FOI Corporation


High Density Plasma Etcher

High Density Plasma Etcher

Company (Alive / Active)

Phone:

Fax: 042-700-3020

1-1-10, Oyama
229-1105
Japan

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Total Funding Date of Last Funding
FOI Corporation $0M Nov 30, 2018

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Investors

Investor Investor Type Location Participating Rounds
Mitsui & Co. Global InvestmentCorporate VentureTokyo, JapanOther Investors
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Patents

Title Application Date Patent Date Status
(Patent / Application)
Nano-energetic activated steam generator Mar 02, 2011 Sep 01, 2015 Patent
Geothermal heat transfer and intensification system and method Jul 23, 2010 Apr 16, 2013 Patent
Heat actuated cooling system Jun 12, 2008 Apr 05, 2011 Patent
Exercise apparatus based on a variable mode hydraulic cylinder and method for same May 02, 2005 Jul 27, 2010 Patent
Method and apparatus for physical fitness training Mar 21, 2007 Jan 19, 2010 Patent
See all 8 patents