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COMPUTER HARDWARE & SERVICES | IT Services / IT Solutions & Software Development
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About EMC2

EMC2 is an ARTEMIS Joint undertaking project that develops computing platforms for embedded systems for criticality mixed applications in a dynamic and changeable real-time environment. It is located in Neubiberg, Germany.

EMC2 Headquarter Location

Am Campeon 1-12

Neubiberg, 85579,

Germany

Latest EMC2 News

Infineon launches Bluetooth LE SoC

Jan 20, 2022

Infineon launches Bluetooth LE SoC Article By : Infineon Technologies AG Infineon's newly launched AIROC CYW20829 Bluetooth LE SoC is a Bluetooth 5.3 core spec-compliant device for IoT, smart home, and industrial applications. Infineon Technologies AG’s newly launched AIROC CYW20829 Bluetooth LE system on chip (SoC) is a Bluetooth 5.3 core spec-compliant device for IoT, smart home, and industrial applications. With the right combination of low power and high performance, AIROC CYW20829 supports the entire spectrum of Bluetooth Low Energy (LE) use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls, and any other Bluetooth LE-connected IoT application. The new device integrates a power amplifier with 10 dBm of transmit output power and has receive sensitivity of -98.5dBm for LE and -106dBm for LE-LR 125kbps for the best link budget in the AIROC Bluetooth portfolio. The best-in-class RF performance offers reliable, robust connectivity without compromising low power—making the CYW20829 ideal for a wide range of applications in smart home, smart building, medical, industrial, mesh and human interface devices (e.g., keyboard, mouse, remote control). The CYW20829 is the first Infineon AIROC Bluetooth SoC to use the ARM Cortex M33. The Bluetooth LE subsystem is architected for low current consumption with a highly optimized radio and an ARM Cortex M33 core focused as the Bluetooth controller. A second ARM Cortex M33 with a floating-point unit is dedicated for customer applications and can be clocked up to 96 MHz to provide high performance compute at low power. The application sub-system is highly integrated with configurable serial communication blocks that can be turned into UART/I 2C/SPI as needed, multiple timer/counter pulse-width modulators, I2S, PDM, CAN, and LIN interfaces. Security is built into the platform architecture with a ROM based root of trust, a TRNG, eFuse for custom keys and cryptography acceleration. For added flexibility, AIROC CYW20829 also supports XIP from external flash as well as encryption on the fly for content on the flash. The AIROC CYW20829 is supported by ModusToolbox, a collection of easy-to-use software and tools enabling rapid development of Bluetooth enabled IoT solutions.

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