Elim Technology
Founded Year
2008About Elim Technology
Elim Technology manufactures electronic equipment. It offers grinding devices, wafer metrology systems, dispensing equipment, and many other products. The company was founded in 2008 and is based in Gyeonggi-do, South Korea.
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Elim Technology Frequently Asked Questions (FAQ)
When was Elim Technology founded?
Elim Technology was founded in 2008.
Where is Elim Technology's headquarters?
Elim Technology's headquarters is located at 323-1 Banwol-Dong, Hwaseong-si,, Gyeonggi-do.
Who are Elim Technology's competitors?
Competitors of Elim Technology include Mecaro and 4 more.
Compare Elim Technology to Competitors
Neontech manufactures automation equipment. It provides a dicing saw, saw and sorter, breaker, tape mounter, wafer cleaner, cutter, and accessories. It is based in Gyeonggi-do, South Korea.
Bell I&S is a creative IT company. It offers services in factory automation service design and consulting, operations service, security solutions, ESBOP, and more. The company was founded in 2008 and is based in Seoul, South Korea.
Intimax is a manufacturer and designer of equipment specializing in electronics with a focus on semiconductors. It offers a wide range of products, which include wafer laminators, wafer-mounted machines, wafer saw machines, ultraviolet irradiation, and pin insert systems. It was founded in 2022 and is based in Suwon-si, South Korea.
OSAI Automation System is a semiconductor machinery manufacturing company. It specializes in automation, electronic machines, semiconductor applications, laser technology, and more. It also provides automatic machines for labs and mass production applications. It was founded in 1991 and is based in Scarmagno, Italy.
ISU System operates as an information technology (IT) company. The company provides solutions for safety management and work efficiency at industrial sites, IT services, and more. It was founded in 1996 and is based in Seoul, South Korea.
Capcon is an equipment manufacturer that provides products and solutions to the advanced semiconductor assembly and packaging industry. Its solutions include flip-chip bonders, chip-on-wafer bonders, package-on-package bonders, stack die bonders, panel-level die bonders, multi-chip die bonders and more. The company was founded in 2014 and is based in Hong Kong.
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