Developer of polymer-based electrical materials and components to prevent damage to electronic circuits caused by electrical overstress (EOS). This proprietary new material, called PolyClamp, protects electronic systems from damage due to electrostatic discharge (ESD). The material's technical strengths are low capacitance, high speed & energy handling capability, and durability after repeated EOS events. PolyClamp's applied cost is significantly below the applied cost of transient voltage suppression diodes. Documentation shows that electrical overstress events cause millions of dollars of repair costs to circuitry such as automotive control, telephones, and computer systems. Costly losses also result from the interruptions caused by the failure of critical communication, processing, or control equipment. There are two families of polymer and filler formulations (PolyClamp I & II) providing design engineers a high degree of flexibility in size and shape to meet high density application needs. Currently the following product forms have been developed: pin & ferrule or tube & ferrule for connectors and other applications; array for connectors and other applications; discoidal applications; leaded disc for printed circuit board (PCB) applications; and direct application of PCBs via lamination, molding, or via SOIC packages.