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Technology Market Intelligence
Technology Market Intelligence
Ebullient brings uniform device temperatures, above 90% savings in cooling costs (compared to traditional air cooling), and unprecedented flexibility; all while reducing maintenance costs, improving reliability, and eliminating risk due to fluid cont...Show all
Company (Alive / Active)
Phone: 608-345-8916
100 S Baldwin Street
Suite 200
Madison, 53703
Wisconsin, United States
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| Title | Application Date | Patent Date | Status (Patent / Application) |
|---|---|---|---|
| Redundant heat sink module | Feb 17, 2015 | Feb 20, 2018 | Patent |
| Method of cooling series-connected heat sink modules | Feb 02, 2015 | Feb 20, 2018 | Patent |
| Heat exchanger with interconnected fluid transfer members | Aug 22, 2015 | Feb 13, 2018 | Patent |
| Mounting bracket for heat sink module | Jun 11, 2015 | Feb 13, 2018 | Patent |
| Microprocessor assembly adapted for fluid cooling | Sep 24, 2015 | Dec 26, 2017 | Patent |
