Ebullient brings uniform device temperatures, above 90% savings in cooling costs (compared to traditional air cooling), and unprecedented flexibility; all while reducing maintenance costs, improving reliability, and eliminating risk due to fluid contact.

Ebullient brings uniform device temperatures, above 90% savings in cooling costs (compared to traditional air cooling), and unprecedented flexibility; all while reducing maintenance costs, improving reliability, and eliminating risk due to fluid cont...Show all

Company (Alive / Active)

Phone: 608-345-8916

Fax:

100 S Baldwin Street
Suite 200
Madison, 53703
Wisconsin, United States

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Total Funding Date of Last Funding
Ebullient $2.8M Jan 15, 2016

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Patents

Title Application Date Patent Date Status
(Patent / Application)
Redundant heat sink module Feb 17, 2015 Feb 20, 2018 Patent
Method of cooling series-connected heat sink modules Feb 02, 2015 Feb 20, 2018 Patent
Heat exchanger with interconnected fluid transfer members Aug 22, 2015 Feb 13, 2018 Patent
Mounting bracket for heat sink module Jun 11, 2015 Feb 13, 2018 Patent
Microprocessor assembly adapted for fluid cooling Sep 24, 2015 Dec 26, 2017 Patent
See all 30 patents