CRESSEM cressem.com


CRESSEM (크레셈) offers process technologies, materials, and equipment related to ultrasonic ACF bonding required for the manufacture of display, semiconductor package, touch panel, smart card, RFID, smart glass, camera module, mobile device, bendable and flexible device, and as such also researches, develops, and manufactures process equipments using vertical vibration ultrasonic waves and ACF and supplies materials, such as packaging materials, OCA, OCR, heat-resistant tape, and radiating t...Show all

CRESSEM (크레셈) offers process technologies, materials, and equipment related to ultrasonic ACF bonding required for the manufacture of display, semiconductor package, touch panel, smart card, RFID, smart glass, camera module, mobile device, bend...Show all

Company (Alive / Active)

Phone: +82 031-427-3445

Fax:

F-dong 702-ho, KAIST Munji Campus
193, Munji-ro, Yuseong-gu
Daejeon,
South Korea

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Total Funding Date of Last Funding
CRESSEM $0M Nov 29, 2018

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