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Binghamton Semiconductor Packaging


Grant | Alive

Total Raised


Last Raised

$80K | 17 yrs ago

About Binghamton Semiconductor Packaging

Binghamton Semiconductor Packaging is a company that received a STTR Phase I grant for a project entitled: Flexible Flip Chip Connection (F2C2) Technology. Their project will advance a modified electronic packaging technique by attaching a silicon chip to a chip carrier using an area array of flexible wires, named Flexible Flip Chip Connection (F2C2) technology. F2C2 uses flexible copper wires as a medium to connect the die to the chip carrier in lieu of solder balls used in current flip chip packaging . This research effort will focus on optimum design and development of F2C2 structure, materials, and process considering reilability, yield.cost and environment. The proposed technology will help eliminate the dependency on lead-based solders; and will solve the coefficient of thermal expansion mismatch problem in electronic packages, thereby improving the reliability of electronic components. This technology will also be potentially applicable to MEMS packaging and other small-scale packages.

Headquarters Location

7 South Washington Street

Binghamton, New York, 13903,

United States




Binghamton Semiconductor Packaging Frequently Asked Questions (FAQ)

  • Where is Binghamton Semiconductor Packaging's headquarters?

    Binghamton Semiconductor Packaging's headquarters is located at 7 South Washington Street, Binghamton.

  • What is Binghamton Semiconductor Packaging's latest funding round?

    Binghamton Semiconductor Packaging's latest funding round is Grant.

  • How much did Binghamton Semiconductor Packaging raise?

    Binghamton Semiconductor Packaging raised a total of $80K.

  • Who are the investors of Binghamton Semiconductor Packaging?

    Investors of Binghamton Semiconductor Packaging include National Science Foundation.



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