Applied Materials
Founded Year
1967Stage
IPO | IPODate of IPO
10/6/1972Market Cap
126.76BStock Price
131.59About Applied Materials
Applied Materials (Nasdaq:AMAT.O) supplies products and services to the global semiconductor industry and is an information infrastructure provider. Applied Materials enables Information for Everyone by helping semiconductor manufacturers produce more portable and affordable chips.
Applied Materials Headquarter Location
3225 Oakland Village Drive Suite 270
Santa Clara, California, 95054,
United States
650-353-2047
Latest Applied Materials News
Oct 15, 2021
Friday's top analyst upgrades and downgrades included Applied Materials, Autodesk, Bank of America, BP, Broadcom, Micron Technology, Morgan Stanley and Western Digital.
Expert Collections containing Applied Materials
Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.
Applied Materials is included in 2 Expert Collections, including Fortune 500 Investor list.
Fortune 500 Investor list
590 items
This is a collection of investors named in the 2019 Fortune 500 list of companies. All CB Insights profiles for active investment arms of a Fortune 500 company are included.
The Edge Computing Landscape
343 items
Edge computing companies facilitate workload deployment in addition to providing data processing and storage at the farthest reaches of the network. These edge computing companies range from data centers at the edge to workload management tools designed to orchestrate edge deploy
Applied Materials Patents
Applied Materials has filed 8566 patents.
The 3 most popular patent topics include:
- Semiconductor device fabrication
- Thin film deposition
- Microtechnology
Application Date | Grant Date | Title | Related Topics | Status |
|---|---|---|---|---|
10/9/2019 | 10/12/2021 | Computer memory, Semiconductor device fabrication, Thin film deposition, USB, Semiconductor technology | Grant | |
Application Date | 10/9/2019 | ||||
|---|---|---|---|---|---|
Grant Date | 10/12/2021 | ||||
Title | |||||
Related Topics | Computer memory, Semiconductor device fabrication, Thin film deposition, USB, Semiconductor technology | ||||
Status | Grant |
