ALLVIA allvia.com


ALLVIA provides Silicon Interposer and Through-Silicon Via (TSV) foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions. ALLVIA, a leader in TSV development, provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume produ...Show all

ALLVIA provides Silicon Interposer and Through-Silicon Via (TSV) foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions. ALLVIA, a ...Show all

Company (Alive / Active)

Phone: 408-720-3333

Fax:

657 North Pastoria Avenue

Sunnyvale, 94086
California, United States

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Total Funding Date of Last Funding
ALLVIA $22M Sep 25, 2014

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Investors

Investor Investor Type Location Participating Rounds
Intel CapitalCorporate VentureSanta Clara, California, United StatesUnattributed VC
Undisclosed InvestorsOtherUnattributed, Series C
C2 Capital CorporationDebt & Specialty FinanceLos Angeles, California, United StatesUnattributed VC
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Patents

Title Application Date Patent Date Status
(Patent / Application)
Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques Aug 21, 2008 Jun 21, 2011 Patent