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ELECTRONICS | Electronic Manufacturing Services
allvia.com

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Founded Year

1997

Stage

Unattributed | Alive

Total Raised

$22.03M

Last Raised

$30K | 7 yrs ago

About ALLVIA

ALLVIA provides Silicon Interposer and Through-Silicon Via (TSV) foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions. ALLVIA, a leader in TSV development, provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

ALLVIA Headquarter Location

657 North Pastoria Avenue

Sunnyvale, California, 94086,

United States

408-720-3333

Latest ALLVIA News

ALLVIA Adds Capabilities for Through-Quartz Vias, Reducing Foundry Cycle Times and Improving Interposer Product Quality

May 1, 2018

ALLVIA Adds Capabilities for Through-Quartz Vias, Reducing Foundry Cycle Times and Improving Interposer Product Quality Silicon Valley foundry installs state-of-the-art via-making equipment to better serve the growing 2.5D and 3D semiconductor markets May 01, 2018 09:40 AM Eastern Daylight Time SUNNYVALE, Calif.--( BUSINESS WIRE )--To meet growing market demand for high-density 2.5D and 3D stacked semiconductor solutions, Silicon Valley-based ALLVIA, Inc. has expanded its in-house capabilities to include the formation of through-quartz vias (TQV) ranging from 15 microns in diameter and 100 microns deep to 50 microns in diameter and 250 microns deep. ALLVIA’s new TQV solution significantly improves the performance of 3D-ICs by creating IC interconnects with lower parasitic capacitance than can be achieved with the earlier generation of through-silicon via (TSV) technology. The company had been outsourcing the production of via holes in the fused silica (quartz) that it uses, but its newly added capability brings all via-drilling operations in-house, expanding ALLVIA’s intellectual property and reducing the cost of production. The company will continue to apply its proprietary technology to fill the high-aspect-ratio via holes with copper plating to fabricate finished interposer products. Sergey Savastiouk, CEO of ALLVIA, said, "Performing our own via drilling in fused silica allows us to improve turnaround times and production volumes for our customers while also delivering better quality using our state-of-the-art technology for copper plating, chemical mechanical polishing and deep via thin-film deposition." In addition to providing via foundry services, ALLVIA applies its technology in manufacturing and selling ultra-thin quartz interposers that form the electrical connections between a silicon chip and a printed circuit board. About ALLVIA ALLVIA, Inc. ( http://www.allvia.com/ ) provides silicon and glass interposers and through-silicon, through-glass and through-quartz via foundry services to the semiconductor, optoelectronics and MEMS industries, meeting the demands of advanced vertical interconnects, 2.5D, 3D and system-in-package (SiP) solutions. A leader in through-silicon via (TSV) development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) TSVs. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs. Contacts

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ALLVIA Patents

ALLVIA has filed 1 patent.

patents chart

Application Date

Grant Date

Title

Related Topics

Status

8/21/2008

6/21/2011

Capacitors, Semiconductor device fabrication, Microtechnology, Lithography (microfabrication), Semiconductor technology

Grant

Application Date

8/21/2008

Grant Date

6/21/2011

Title

Related Topics

Capacitors, Semiconductor device fabrication, Microtechnology, Lithography (microfabrication), Semiconductor technology

Status

Grant

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