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ELECTRONICS | Chips & Semiconductors / Semiconductors
akustica.com

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Founded Year

2001

Stage

Unattributed VC - VII | Alive

Total Raised

$35.43M

Last Raised

$40K | 14 yrs ago

About Akustica

Akustica designs sound solutions that improve the way sound is captured, processed, and reproduced in electronic products. Its Micro-electro-mechanical systems (MEMS)-based acoustic System-on-Chip solutions deliver exceptional performance capabilities and design advantages over conventional acoustic components. Akustica's patented process aims to allow it to deliver great sound in an extremely small package. Akustica's acoustic System-on-Chip solutions - called Microphone Chips and Speaker Chips - combine the functionality of MEMS microphones or speakers with software and microelectronics onto a single, standard CMOS semiconductor chip. Unlike other MEMS chips that are fabricated using captive, costly and cumbersome manufacturing processes, the starting point for the manufacture of Akustica's chips are standard CMOS wafers which can be produced at any standard CMOS foundry.

Akustica Headquarter Location

2835 East Carson Street Suite 301

Pittsburgh, Pennsylvania, 15203,

United States

412-390-1730

Latest Akustica News

Akustica announces three new MEMS microphones for smartphones

Mar 2, 2017

Ultra-high mechanical and electrical robustness combined with outstanding electro-acoustic performance Industry standard footprints enable straightforward upgrade in performance, reliability, and robustness of current system designs Highly robust top- and bottom-port metal-lid packages Single-ended and differential-output microphones for complete system design flexibility March 01, 2017 09:00 PM Eastern Standard Time PITTSBURGH--( BUSINESS WIRE )--Today, Akustica is launching three new analog-output microphones designed to improve the accuracy of the ever-growing number of speech recognition applications in smartphones and wearable devices. With the introduction of the BMU563R, BMU551R, and BMU537R, Akustica is once again demonstrating how the close collaboration of a complete in-house design team leads to the high levels of innovation required to deliver exceptional products that meet or exceed customer requirements. The new microphones are housed in mechanically and electrically robust top- (BMU551R) and bottom-port (BMU563R and BMU537R) metal-lid packages. In combination with next-generation MEMS sensor design, the metal-lid packages enable the microphones to withstand the many mechanical stresses, such as rough handling or dropping, that occur during manufacturing and end-use. The Faraday cage package construction with gold-plated lids and enhanced filtering provides additional radiated radio frequency (RF) rejection in wireless frequency bands. The added RF immunity reduces the burden of external filtering components and decreases the number of necessary board redesign and testing re-certifications, thereby shortening time-to-market and reducing development as well as overall system costs. The microphones can also withstand more than twice the IEC specification for electrostatic discharge (ESD), improving both manufacturing and end-user reliability. The BMU563R and BMU551R deliver excellent electro-acoustic performance, featuring a high signal-to-noise ratio (SNR) of 66dB while also providing a uniform sensitivity (+/-1dB) and a flat frequency response. Combined with an ultra-low total-harmonic-distortion (THD) of less than 1 percent up to 118dB SPL, these microphones improve the performance of noise cancelling algorithms, especially in far-field applications. Additionally, the BMU551R draws only 60µA in full performance mode, less than half the power consumption of comparable high-performance microphones, helping to extend battery life. With industry standard footprints of 3.50 x 2.65mm2, these new microphones are ideal for upgrading the RF immunity, robustness, and performance of existing designs. In its industry standard 3.35 x 2.50mm2 form factor, the BMU537R also delivers an excellent 66dB SNR and a high degree of robustness. Additionally, the differential output of the BMU537R enables other performance benefits such as a high 130dB acoustic overload point (AOP), with THD remaining less than 1 percent to 124dB SPL. When a microphone ‘hears’ a sound whose level exceeds its AOP, it no longer provides a clear audio stream to the next component in the system. Therefore, not only is a high AOP microphone desirable for high-quality recordings in loud settings such as rock concerts, but it also enables the audio processor to continue performing optimal noise suppression even in windy or other loud environments. The differential output of the BMU537R also minimizes audio signal corruption from electronic crosstalk and electromagnetic interference from nearby components. “The way we interact with mobile devices continues to develop and is shifting towards speech,” said Horst Muenzel, CEO and General Manager, Akustica. “Voice starts at the microphone and with our in-house expertise in all parts of the microphone design, Akustica is uniquely positioned to continue delivering the innovative and increasingly high-performance microphones that make up the front end of our customers’ voice-controlled devices.” The BMU563R and BMU551R are available in production quantities while the BMU537R is currently sampling to lead customers. For samples and customer pricing information, please visit www.akustica.com/contact.asp to find a local sales representative. Contacts

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Akustica Patents

Akustica has filed 26 patents.

The 3 most popular patent topics include:

  • Microtechnology
  • Sensors
  • Gas sensors
patents chart

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6/28/2018

5/18/2021

Semiconductor device fabrication, Capacitors, Microtechnology, Transistor types, Semiconductor technology

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Semiconductor device fabrication, Capacitors, Microtechnology, Transistor types, Semiconductor technology

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