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adt-co.com

Founded Year

2003

Stage

Acq - Fin | Alive

Valuation

$0000 

About Advanced Dicing Technologies

Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).

Advanced Dicing Technologies Headquarter Location

5 HaMada St., P.O. Box 87

Yokneam, 2069202,

Israel

+972-4-8545222

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Expert Collections containing Advanced Dicing Technologies

Expert Collections are analyst-curated lists that highlight the companies you need to know in the most important technology spaces.

Advanced Dicing Technologies is included in 1 Expert Collection, including Semiconductors, Chips, and Advanced Electronics.

S

Semiconductors, Chips, and Advanced Electronics

6,091 items

Companies in this collection develop everything from microprocessors to flash memory, integrated circuits specifically for quantum computing and artificial intelligence to OLED for displays, massive production fabs to circuit design firms, and everything in between.

Latest Advanced Dicing Technologies News

Global Wafer Mounter Equipment Market 2017-2021 with Advanced Dicing Technologies, DISCO & Semiconductor Equipment Dominating - Research and Markets

Dec 14, 2017

The global wafer mounter equipment market to grow at a CAGR of 4.42% during the period 2017-2021. Global Wafer Mounter Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. According to the report, one of the major drivers for this market is Increase in capital spending. The global semiconductor industry is expected to witness a surge in capital spending, especially after the cyclical period in 2016. This increase in capital spending is a major driver for the global wafer mounter equipment market as it indicates that foundries and memory manufacturers are aiming at investing funds in purchasing new equipment as per the latest technological developments in the industry. The latest trend gaining momentum in the market is Increase in the wafer size. The semiconductor industry is continuously evolving with rapid technological advancements and transitions such as the miniaturization of nodes and the rise in the wafer sizes. Hence, to survive in this changing, competitive landscape, equipment manufacturers need to develop new technologies that are in line with the changes in the semiconductor IC architecture. Market trends Surging development of the Chinese semiconductor industry Use of NEMS

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  • When was Advanced Dicing Technologies founded?

    Advanced Dicing Technologies was founded in 2003.

  • Where is Advanced Dicing Technologies's headquarters?

    Advanced Dicing Technologies's headquarters is located at 5 HaMada St., P.O. Box 87, Yokneam.

  • What is Advanced Dicing Technologies's latest funding round?

    Advanced Dicing Technologies's latest funding round is Acq - Fin.

  • Who are the investors of Advanced Dicing Technologies?

    Investors of Advanced Dicing Technologies include Neng Yang and Teuza.

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